A Low-Loss Balun-Embedded Interconnect for THz Heterogeneous System Integration

An interconnect for THz heterogeneous integration is proposed in this work. Two transmission lines deployed on a 40-nm CMOS chip and an IPD carrier, respectively, are coupled together to form a Marchand balun during a flip-chip packaging process. By doing this, the proposed interconnect can provide...

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Bibliographic Details
Main Authors: Chiu, Te-Yen, Lee, Yu-Ling, Ko, Chun-Lin, Tseng, Sheng-Hsiang, Li, Chun-Hsing
Format: Conference Proceeding
Language:English
Subjects:
Baluns
heterogeneous integration
Insertion loss
interconnect
low-loss
Marchand balun
Microwave measurement
Packaging
Power transmission lines
Semiconductor device measurement
System integration
THz
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Description
Summary:An interconnect for THz heterogeneous integration is proposed in this work. Two transmission lines deployed on a 40-nm CMOS chip and an IPD carrier, respectively, are coupled together to form a Marchand balun during a flip-chip packaging process. By doing this, the proposed interconnect can provide packaging and balun functions simultaneously. Two interconnects using the proposed idea are demonstrated with measured and simulated insertion loss of 0.9 and 1.4 dB at 169 and 340 GHz, respectively.
ISSN:2576-7216
DOI:10.1109/IMS30576.2020.9224046