High density packaging for mobile terminals

Personal electronics devices are miniaturized to be more comfortable to carry, this size reduction desire, together with increased functionality, have become drivers, especially for wireless devices. Mobile terminal electronics have set a challenge for packaging and provided the motivation to verify...

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Bibliographic Details
Main Authors: Pienimaa, S.K., Martin, N.I.
Format: Conference Proceeding
Language:English
Subjects:
Assembly
Chip scale packaging
Digital integrated circuits
Displays
Driver circuits
Electronics packaging
Filtering
Home appliances
Soldering
Timing
Online Access:Request full text
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Description
Summary:Personal electronics devices are miniaturized to be more comfortable to carry, this size reduction desire, together with increased functionality, have become drivers, especially for wireless devices. Mobile terminal electronics have set a challenge for packaging and provided the motivation to verify emerging technologies. Chip Scale Packages (CSP), flip-chip and passive integration technologies have been verified by building two technology verifiers, both GSM mobile terminals based on the electronics of existing products. High Density PWB (HDPWB) technologies were selected to provide the required routing density for flip-chip assembly. These electronics modules were assembled into the mechanics of existing mobile terminals, facilitating full electrical characterization.
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.2001.927966