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AlSb/InAs HEMTs with a TiW/Au gate metalization
We report on the fabrication and characteristics of AlSb/InAs HEMTs with a TiW/Au gate metalization. Prior to the metal evaporation, the usual oxygen plasma surface pretreatment was adjusted to minimize damage. These HEMTs exhibit decreased gate leakage current in the low drain bias region and simil...
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creator | Boos, J.B. Bennett, B.R. Kruppa, W. Park, D. Mittereder, J. Turner, N.H. |
description | We report on the fabrication and characteristics of AlSb/InAs HEMTs with a TiW/Au gate metalization. Prior to the metal evaporation, the usual oxygen plasma surface pretreatment was adjusted to minimize damage. These HEMTs exhibit decreased gate leakage current in the low drain bias region and similar microwave performance compared to previous HEMTs fabricated from the same material with a Cr/Au gate metal. The HEMTs were found to be thermally stable up to 180/spl deg/C when heat treated in a H/sub 2//N/sub 2/ ambient. TiW/Au diode test structures fabricated on similar HEMT material were thermally stable up to 270/spl deg/C. |
doi_str_mv | 10.1109/ICIPRM.2001.929174 |
format | conference_proceeding |
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Prior to the metal evaporation, the usual oxygen plasma surface pretreatment was adjusted to minimize damage. These HEMTs exhibit decreased gate leakage current in the low drain bias region and similar microwave performance compared to previous HEMTs fabricated from the same material with a Cr/Au gate metal. The HEMTs were found to be thermally stable up to 180/spl deg/C when heat treated in a H/sub 2//N/sub 2/ ambient. TiW/Au diode test structures fabricated on similar HEMT material were thermally stable up to 270/spl deg/C.</description><identifier>ISSN: 1092-8669</identifier><identifier>ISBN: 0780367006</identifier><identifier>ISBN: 9780780367005</identifier><identifier>DOI: 10.1109/ICIPRM.2001.929174</identifier><language>eng</language><publisher>IEEE</publisher><subject>Electromagnetic heating ; Fabrication ; Gold ; HEMTs ; Inorganic materials ; Leakage current ; MODFETs ; Plasma materials processing ; Plasma properties ; Plasma stability</subject><ispartof>Conference Proceedings. 2001 International Conference on Indium Phosphide and Related Materials. 13th IPRM (Cat. 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TiW/Au diode test structures fabricated on similar HEMT material were thermally stable up to 270/spl deg/C.</description><subject>Electromagnetic heating</subject><subject>Fabrication</subject><subject>Gold</subject><subject>HEMTs</subject><subject>Inorganic materials</subject><subject>Leakage current</subject><subject>MODFETs</subject><subject>Plasma materials processing</subject><subject>Plasma properties</subject><subject>Plasma stability</subject><issn>1092-8669</issn><isbn>0780367006</isbn><isbn>9780780367005</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2001</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNotj81Kw0AURgdUsNa-QFfzAknu_M9dhlBtoEXRgMsyM5noSFqlExF9egv125zN4cBHyJJByRhg1Tbt49O25ACsRI7MyAtyA8aC0AZAX5LZyeKF1RqvySLndzhNKim0npGqHp991R7qTNerbZfpd5reqKNdeqnqL_rqpkj3cXJj-nVT-jjckqvBjTku_jkn3d2qa9bF5uG-bepNkRjIqeAqRq16PvDeBY9BaqGBB4vWaD947KNVwI2zGIQXxjEcPFMCXbCWMyPmZHnOphjj7vOY9u74szu_E38YvUFj</recordid><startdate>2001</startdate><enddate>2001</enddate><creator>Boos, J.B.</creator><creator>Bennett, B.R.</creator><creator>Kruppa, W.</creator><creator>Park, D.</creator><creator>Mittereder, J.</creator><creator>Turner, N.H.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>2001</creationdate><title>AlSb/InAs HEMTs with a TiW/Au gate metalization</title><author>Boos, J.B. ; Bennett, B.R. ; Kruppa, W. ; Park, D. ; Mittereder, J. ; Turner, N.H.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i104t-25ee65d2f2dacb9c463602c89876bfb9de85027a89c3b37a19fb1539ac882173</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2001</creationdate><topic>Electromagnetic heating</topic><topic>Fabrication</topic><topic>Gold</topic><topic>HEMTs</topic><topic>Inorganic materials</topic><topic>Leakage current</topic><topic>MODFETs</topic><topic>Plasma materials processing</topic><topic>Plasma properties</topic><topic>Plasma stability</topic><toplevel>online_resources</toplevel><creatorcontrib>Boos, J.B.</creatorcontrib><creatorcontrib>Bennett, B.R.</creatorcontrib><creatorcontrib>Kruppa, W.</creatorcontrib><creatorcontrib>Park, D.</creatorcontrib><creatorcontrib>Mittereder, J.</creatorcontrib><creatorcontrib>Turner, N.H.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Xplore</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Boos, J.B.</au><au>Bennett, B.R.</au><au>Kruppa, W.</au><au>Park, D.</au><au>Mittereder, J.</au><au>Turner, N.H.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>AlSb/InAs HEMTs with a TiW/Au gate metalization</atitle><btitle>Conference Proceedings. 2001 International Conference on Indium Phosphide and Related Materials. 13th IPRM (Cat. No.01CH37198)</btitle><stitle>ICIPRM</stitle><date>2001</date><risdate>2001</risdate><spage>460</spage><epage>463</epage><pages>460-463</pages><issn>1092-8669</issn><isbn>0780367006</isbn><isbn>9780780367005</isbn><abstract>We report on the fabrication and characteristics of AlSb/InAs HEMTs with a TiW/Au gate metalization. Prior to the metal evaporation, the usual oxygen plasma surface pretreatment was adjusted to minimize damage. These HEMTs exhibit decreased gate leakage current in the low drain bias region and similar microwave performance compared to previous HEMTs fabricated from the same material with a Cr/Au gate metal. The HEMTs were found to be thermally stable up to 180/spl deg/C when heat treated in a H/sub 2//N/sub 2/ ambient. TiW/Au diode test structures fabricated on similar HEMT material were thermally stable up to 270/spl deg/C.</abstract><pub>IEEE</pub><doi>10.1109/ICIPRM.2001.929174</doi><tpages>4</tpages></addata></record> |
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ispartof | Conference Proceedings. 2001 International Conference on Indium Phosphide and Related Materials. 13th IPRM (Cat. No.01CH37198), 2001, p.460-463 |
issn | 1092-8669 |
language | eng |
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source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Electromagnetic heating Fabrication Gold HEMTs Inorganic materials Leakage current MODFETs Plasma materials processing Plasma properties Plasma stability |
title | AlSb/InAs HEMTs with a TiW/Au gate metalization |
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