Design and Analysis of Thermal Transmission Line based Embedded Cooling Structures for High Bandwidth Memory Module and 2.5D/3D ICs

• Main Authors: Son, Keeyoung, Kim, Subin, Park, Shinyoung, Park, Hyunwook, Kim, Keunwoo, Shin, Taein, Kim, Minsu, Son, Kyungjune, Park, Gapyeol, Jeong, Seungtaek, Kim, Joungho
• Format: Conference Proceeding
• Language: English
• Subjects: Cooling; Heat transfer; High bandwidth memory; Integrated circuits; Junction temperature; Power transmission lines; Signal integrity; System-on-chip; Thermal integrity; Thermal management; Thermal Transmission Line; Through-silicon vias
• ISSN: 2151-1233
• DOI: 10.1109/EDAPS50281.2020.9312897

In this paper, we firstly proposed a thermal transmission line (TTL) based embedded cooling structure for advanced thermal management of a next-generation high bandwidth memory (HBM) module. Thermal issues are critical to the development of HBM and 2.5D/3D ICs. The proposed TTL based embedded cooling structures can be one of the promising thermal management solutions for the 2.5D/3D ICs. The previous embedded cooling structures have thermal management limitations of the difficulties of cooling the internal heat of the 2.5D/3D ICs each layer. The proposed TTL transfers internal heat to the coolant to lowering junction temperature. Moreover, we checked the fabrication feasibility of the TTL with through silicon vias (TSVs). By using 3D electromagnetic (EM) and 3D fluent simulations, we analyzed the proposed TTL considering signal integrity (SI) and thermal integrity (TI). SI analysis showed the TTL does not contribute critical SI issues for HBM on-chip TSV channels. TI analysis provided the thermal management superiority of the TTL. As a result, it showed the improvement of TI of HBM module decreased HBM junction temperature by 4.789°C compared to the previous embedded cooling structure.