Multigigabit/s operations of 16-wavelength vertical-cavity surface-emitting laser array

A multiple-wavelength 2*8 monolithic surface-emitting laser array with a potential aggregate array capacity of 80 Gb/s is reported. The high-speed packaging for the array was made possible with a slip-chip bonding technique, and each laser was capable of 5 Gb/s operation. The chirp-broadened 20-dB s...

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Bibliographic Details
Published in:IEEE photonics technology letters 1991-10, Vol.3 (10), p.863-865
Main Authors: Maeda, M.W., Chang-Hasnain, C., Von Lehmen, A., Izadpanah, H., Lin, C., Iqbal, M.Z., Florez, L., Harbison, J.
Format: Article
Language:English
Subjects:
Aggregates
Bonding
Chirp
Crosstalk
High speed optical techniques
Optical arrays
Optical surface waves
Packaging
Surface emitting lasers
Vertical cavity surface emitting lasers
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Summary:A multiple-wavelength 2*8 monolithic surface-emitting laser array with a potential aggregate array capacity of 80 Gb/s is reported. The high-speed packaging for the array was made possible with a slip-chip bonding technique, and each laser was capable of 5 Gb/s operation. The chirp-broadened 20-dB spectral width was less than 0.3 mm and the spectra occupied 16 independent wavelengths. Both optical and thermal crosstalks were very small, and the electrical crosstalk ranged from
ISSN:1041-1135
1941-0174
DOI:10.1109/68.93242