Multi-level Metallization on an Elastomer PDMS for FOWLP-based Flexible Hybrid Electronics

In order to fabricate a wearable flexible display as a flexible hybrid electronic (FHE) device with micro-LED dies, we demonstrate multi-level metallization on an elastomer using die-first fan-out wafer-level packaging (FOWLP). The elastic substrate of this display is PDMS (polydimethylsiloxane) in...

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Bibliographic Details
Main Authors: Wang, Zhe, Ozawa, Ikumi, Susumago, Yuki, Odashima, Tomo, Takahashi, Noriyuki, Kino, Hisashi, Tanaka, Tetsu, Fukushima, Takafumi
Format: Conference Proceeding
Language:English
Subjects:
Conferences
Metallization
Stress
Substrates
Wafer scale integration
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Summary:In order to fabricate a wearable flexible display as a flexible hybrid electronic (FHE) device with micro-LED dies, we demonstrate multi-level metallization on an elastomer using die-first fan-out wafer-level packaging (FOWLP). The elastic substrate of this display is PDMS (polydimethylsiloxane) in which the array of 3-color micro-LEDs is embedded. In this study, we address serious issues such as die shift and stress accumulation in advanced FOWLP to integrate a self-luminescent flexible micro-LED display.
ISSN:2380-6338
DOI:10.1109/IITC51362.2021.9537540