Multi-Element Thermal Modeling of Interconnects Derived from a Projection-based Leaning Algorithm

An approach combining domain decomposition and model order reduction enabled by a data-driving learning algorithm is developed for thermal simulation of interconnects. The approach accounts for variations of heat sources, boundary conditions (BCs) and material properties. This approach is applied to...

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Bibliographic Details
Main Authors: Cheng, Ming-C., Jia, Wangkun
Format: Conference Proceeding
Language:English
Subjects:
data science
domain decomposition
FinFETs
Integrated circuit modeling
interconnects
model order reduction
Partitioning algorithms
Semiconductor process modeling
Thermal decomposition
Thermal simulation
Training
Wires
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Summary:An approach combining domain decomposition and model order reduction enabled by a data-driving learning algorithm is developed for thermal simulation of interconnects. The approach accounts for variations of heat sources, boundary conditions (BCs) and material properties. This approach is applied to construct the thermal model of a generic element for a group of interconnects that are used to wire FinFET standard cells. The interconnect structure in a FinFET IC is then partitioned into several elements, each modeled by the generic element model. The developed multi-element thermal simulation of the interconnects is demonstrated and its accuracy is examined in terms of the metal/via routings and BCs.
ISSN:1946-1577
DOI:10.1109/SISPAD54002.2021.9592588