Effect of Cable-bend on CISPR25 CE Current Method

Conducted Emissions (CE) contributes to a significant percentage of compliance failures in the verification stage of electronic hardware. In this work, the effect of cable-bend on the CE results is studied. The cable bend at the LISN-end can affect the common mode impedance due to the change in the...

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Bibliographic Details
Main Authors: Nayak, B. P., Muniganti, H., Sugo, H., Sarai, Y., Tsuda, T., Gope, D.
Format: Conference Proceeding
Language:English
Subjects:
Cable-bend
CISPR25
Conducted Emission (CE)
Current measurement
Electromagnetic compatibility
Hardware
Impedance
LISN
Mutual coupling
Three-dimensional displays
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Summary:Conducted Emissions (CE) contributes to a significant percentage of compliance failures in the verification stage of electronic hardware. In this work, the effect of cable-bend on the CE results is studied. The cable bend at the LISN-end can affect the common mode impedance due to the change in the mutual coupling between the cables. A full-system hybrid-solver capability is implemented based on the observations. The cable bend effect is demonstrated using the simulation setup comprising of LISN, cable harness and D UT. The effect is further validated using measurements.
ISSN:2640-7469
DOI:10.1109/APEMC49932.2021.9596715