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Vertical Integration of Pressure/Humidity/Temperature Sensors for CMOS-MEMS Environmental Sensing Hub
This study presents the environmental sensing hub with vertical integration of humidity, pressure, and temperature sensors on a single chip (Fig. 1). The presented device is fabricated through TSMC 0.18 µ m 1P6M CMOS platform, and in-house post-CMOS processes. The proposed environmental sensing hub...
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Main Authors: | , , , |
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Format: | Conference Proceeding |
Language: | English |
Subjects: | |
Online Access: | Request full text |
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Summary: | This study presents the environmental sensing hub with vertical integration of humidity, pressure, and temperature sensors on a single chip (Fig. 1). The presented device is fabricated through TSMC 0.18 µ m 1P6M CMOS platform, and in-house post-CMOS processes. The proposed environmental sensing hub has following features: (1) monolithic integration of humidity (H), pressure (P), and temperature (T) sensors to form the sensing hub, (2) vertical integration of H/P/T sensors to reduce the footprint of chip (as compare with the existing side by side designs). Measurement results of presented environmental sensing hub are: humidity sensor with sensitivity of 2.025fF/%RH, pressure sensor with sensitivity of 0.38fF/kPa, and diode temperature detector with sensitivity of 1.6mV/ o C. |
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ISSN: | 2168-9229 |
DOI: | 10.1109/SENSORS47087.2021.9639781 |