Thermal Challenges for HPC 3DFabricTM Packages and Systems

With HPC devices continue to scale up for higher power and higher power density, thermal dissipation management for IC packages are becoming an important issue. This paper presents the thermal solution evolution at package level and system level, that drives towards more advanced package TIM1 soluti...

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Bibliographic Details
Main Authors: Yan, Kathy Wei, Lin, Po-Yao, Kuo, Sheng-Liang
Format: Conference Proceeding
Language:English
Subjects:
air cooling
Density measurement
Electronic packaging thermal management
hot spot
Immersion cooling
Performance evaluation
Power system measurements
Thermal dissipation
Thermal management
Three-dimensional displays
TIM
Online Access:Request full text
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Summary:With HPC devices continue to scale up for higher power and higher power density, thermal dissipation management for IC packages are becoming an important issue. This paper presents the thermal solution evolution at package level and system level, that drives towards more advanced package TIM1 solution and liquid or immersion cooling solution. Thermal-aware device floorplan, package thermal solution and advanced system cooling solution are critical to enable HPC application
ISSN:1938-1891
DOI:10.1109/IRPS48227.2022.9764572