Cracking-Less Heat-Resistant Electroless Ni-P Plating Film for Wide Bandgap Power Modules

High performance wide band-gap power device is expected to be operated in high temperature. Electroless Ni-P plating film is widely used to provide suitable surface for device packaging. However, commonly used electroless Ni-P plating (P: 6-12 wt %) causes embrittlement resulting cracking in high te...

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Bibliographic Details
Main Authors: Hsieh, Ming-Chun, Chen, Chuantong, Suetake, Aiji, Zhang, Zheng, Suganuma, Katsuaki, Saito, Ryuji, Hasegawa, Norihiko, Hashizume, Kei, Otsuka, Kuniaki
Format: Conference Proceeding
Language:English
Subjects:
electroless Ni-P plating
Heat treatment
heat-resistant
Heating systems
High-temperature superconductors
Photonic band gap
Plating
power device
reliability
Resistance
Temperature
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Summary:High performance wide band-gap power device is expected to be operated in high temperature. Electroless Ni-P plating film is widely used to provide suitable surface for device packaging. However, commonly used electroless Ni-P plating (P: 6-12 wt %) causes embrittlement resulting cracking in high temperature. In this study, we introduce a cracking-less, heat-resistant electroless Ni-P plating film and its heat-resistant characteristics in comparison with conventional plating films.
ISSN:2377-5726
DOI:10.1109/ECTC51906.2022.00209