Influences of various dielectrics materials on p++ silicon diaphragm

Effects of various dielectric materials on thermal stress in p++ silicon diaphragm were analyzed. In this work the modeling of thin film deposition based on the finite element analysis (FEA) is described. The theoretical results predict the change of mechanical performance when various dielectric ma...

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Bibliographic Details
Main Authors: Junmiao Wu, Deshu Zou, Guo Gao, Lan Li, Nanhui Niu, Guangdi Shen
Format: Conference Proceeding
Language:English
Subjects:
Biosensors
Boron
Dielectric devices
Dielectric materials
Etching
Mechanical sensors
Silicon
Tensile stress
Thermal expansion
Thermal stresses
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Summary:Effects of various dielectric materials on thermal stress in p++ silicon diaphragm were analyzed. In this work the modeling of thin film deposition based on the finite element analysis (FEA) is described. The theoretical results predict the change of mechanical performance when various dielectric materials were deposited on p++ silicon diaphragm.
DOI:10.1109/ICSICT.2001.982022