Innovation, Research and Development in Engineering Education. Activities of the Spanish Chapter of the IEEE Education Society: Directive Board of the IEEE Education Society Spanish Chapter 2020-2021

The Technical Committee of the CESEI (Spanish Chapter of the IEEE Education Society) is focused on the Innovation, Research and Development (I+R+D) of the education in engineering, mainly Electric and Computer Engineering. As in other interdisciplinary fields, the I+R+D involves several sources of i...

Full description

Saved in:
Bibliographic Details
Main Authors: Bonastre, Oscar Martinez, Fernandez, Cristina, Vicent, Lluis, Mur, Francisco, Castro, Manuel, Diaz, Gabriel, Carpio, Jose, Sancristobal, Elio, Martin, Sergio, Sanchez, Jose, Solsona, Francisco Javier Arcega, Muro, Juan Suardiaz, Caeiro-Rodriguez, Manuel, Llamas, Martin, Plaza, Inmaculada, Manjon, Baltasar Fernandez, Munoz-Merino, Pedro, Tovar, Edmundo, Ayo, Telmo Zarraonandia, Zubia, Javier Garcia, Penin, Jose Antonio Delgado
Format: Conference Proceeding
Language:English
Subjects:
Collaboration
Engineering education
Research and development
Stakeholders
Technological innovation
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The Technical Committee of the CESEI (Spanish Chapter of the IEEE Education Society) is focused on the Innovation, Research and Development (I+R+D) of the education in engineering, mainly Electric and Computer Engineering. As in other interdisciplinary fields, the I+R+D involves several sources of information and different stakeholders, each one with its own focus and purpose. As a result, sometimes it may be complex for practitioners and researchers to identify the more appropriate entities for their interests. This paper shows how the CESEI Technical Committee tries to solve this difficulty by providing updated information regarding the main publications (journals), events (conferences) and awards to the best academic works. The paper focuses special attention on the activities held during 2020-2021.
ISSN:2766-2616
DOI:10.1109/TAEE54169.2022.9840674