Graphene-Based Wireless Agile Interconnects for Massive Heterogeneous Multi-Chip Processors

The main design principles in computer architecture have recently shifted from a monolithic scaling-driven approach to the development of heterogeneous architectures that tightly co-integrate multiple specialized processor and memory chiplets. In such data-hungry multi-chip architectures, current Ne...

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Bibliographic Details
Published in:IEEE wireless communications 2023-08, Vol.30 (4), p.162-169
Main Authors: Abadal, Sergi, Guirado, Robert, Taghvaee, Hamidreza, Jain, Akshay, de Santana, Elana Pereira, Bolivar, Peter Haring, Saeed, Mohamed, Negra, Renato, Wang, Zhenxing, Wang, Kun-Ta, Lemme, Max C., Klein, Joshua, Zapater, Marina, Levisse, Alexandre, Atienza, David, Rossi, Davide, Conti, Francesco, Dazzi, Martino, Karunaratne, Geethan, Boybat, Irem, Sebastian, Abu
Format: Article
Language:English
Subjects:
Antenna arrays
Antennas
Computer architecture
Graphene
Microprocessors
Multicore processing
Processors
Program processors
Terahertz frequencies
Wireless communication
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Summary:The main design principles in computer architecture have recently shifted from a monolithic scaling-driven approach to the development of heterogeneous architectures that tightly co-integrate multiple specialized processor and memory chiplets. In such data-hungry multi-chip architectures, current Networks-in-Package (NiPs) may not be enough to cater to their heterogeneous and fast-changing communication demands. This position article makes the case for wireless in-package networking as the enabler of efficient and versatile wired-wireless interconnect fabrics for massive heterogeneous processors. To that end, the use of graphene-based antennas and transceivers with unique frequency-beam reconfigurability in the terahertz band is proposed. The feasibility of such a wireless vision and the main research challenges toward its realization are analyzed from the technological, communications, and computer architecture perspectives.
ISSN:1536-1284
1558-0687
DOI:10.1109/MWC.010.2100561