Assembly Reliability of eWLP, Die- and Die-Size BGA

This paper presents assembly challenges as well as solder joint thermal-cycle reliability of mixed area array packaging and flip-chip die technologies. These were: (1) eWLP-LGA, 196 land patterns, 0.4mm pitch, (2) Cu-FC (CC80), flip-chip die with copper pillar, 1048 bumps, and (3) CVBGA, 360 balls,...

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Bibliographic Details
Main Author: Ghaffarian, Reza
Format: Conference Proceeding
Language:English
Subjects:
ball grid array
BGA
chip array BGA
embedded wafer level package
eWLP
Failure analysis
Flip-chip devices
land grid array
LGA
Reliability
Semiconductor device reliability
solder joint reliability
thermal cycle
Thermal resistance
Thermomechanical processes
Transmission line matrix methods
Weibull
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Summary:This paper presents assembly challenges as well as solder joint thermal-cycle reliability of mixed area array packaging and flip-chip die technologies. These were: (1) eWLP-LGA, 196 land patterns, 0.4mm pitch, (2) Cu-FC (CC80), flip-chip die with copper pillar, 1048 bumps, and (3) CVBGA, 360 balls, 0.4mm pitch and with either lead-free or tin-lead solder balls.Twenty-seven (27) PCBs were assembled with a number of variables and rejected assemblies. Acceptable assemblies with and without underfill were subjected to thermal cycling between -40°C and 125°C for solder-joint reliability characterization and failure-mechanism assessments. The 2-parameter Weibull plots delineated cumulative failures and optical X-sectional characterization presented failure mechanisms and locations.
ISSN:2694-2135
DOI:10.1109/iTherm54085.2022.9899504