Fabrication and packaging of a miniature sensor array for harsh environments

This paper describes the fabrication of devices to be used in harsh environments. The devices should operate under extreme conditions: high temperature (180/spl deg/C), high pressure (200 bar) and in a chemically aggressive environment. Therefore, packaging is a major concern. Sensor fabrication and...

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Bibliographic Details
Main Authors: Dijkstra, E.A., Olthuis, W., Bomer, J.G., Bergveld, P., Kronemeijer, D.A.
Format: Conference Proceeding
Language:English
Subjects:
Chemical sensors
Conductivity
Fabrication
Mechanical sensors
Packaging
Petroleum
Pipelines
Powders
Sensor arrays
Temperature sensors
Online Access:Request full text
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Description
Summary:This paper describes the fabrication of devices to be used in harsh environments. The devices should operate under extreme conditions: high temperature (180/spl deg/C), high pressure (200 bar) and in a chemically aggressive environment. Therefore, packaging is a major concern. Sensor fabrication and packaging is described. Two devices were made and tested at the temperature and pressure mentioned above.
DOI:10.1109/MEMSC.2001.992731