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Modular Measurement System for System-Efficient ESD Design on System and Component Level

For the electrostatic discharge (ESD) characterization of components or systems, complex measurements of voltages and currents are required. The measurements are then used to characterize, model, and verify simulations. Both physical damage and upset are expected; however, performing these experimen...

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Bibliographic Details
Published in:IEEE transactions on electromagnetic compatibility 2022-12, Vol.64 (6), p.1-8
Main Authors: Speckbacher, Lucas, Pak, Amin, Gholizadeh, Mehdi, Mousavi, Seyed Mostafa, Pommerenke, David Johannes, Gossner, Harald
Format: Article
Language:English
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Summary:For the electrostatic discharge (ESD) characterization of components or systems, complex measurements of voltages and currents are required. The measurements are then used to characterize, model, and verify simulations. Both physical damage and upset are expected; however, performing these experiments on evaluation boards is often not suitable since the required current and voltage ports are not integrated. Furthermore, repeatedly reworking the integrated circuit (IC) will quickly destroy the evaluation board. A new modular experimental platform was therefore developed to flexibly perform such complex measurements. The modularity greatly simplifies measurements and allows for replacement of damaged components. The system consists of injection modules, such as universal serial bus (USB) and sub miniature version A (SMA) connections, excitation modules, such as a transmission line pulse and an ESD generator, modules for voltage and current measurements for characterization of transient voltage suppressor diodes and ICs, modules carrying passive channels, and active modules for the ICs being characterized. As active parts, which serve as device under tests, a set of USB 3.1 repeaters, controller area network (CAN) bus, and radio frequency (RF) front-end ICs are added to individual modules. The modules themselves, their characterization, and usage are explained in this article.
ISSN:0018-9375
1558-187X
DOI:10.1109/TEMC.2022.3214438