Electromigration discussion group summary

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Bibliographic Details
Main Author: Schafft, H.A.
Format: Conference Proceeding
Language:English
Subjects:
Circuit testing
Copper
Electromigration
Extrapolation
Failure analysis
Guidelines
Integrated circuit interconnections
Maintenance
NIST
Stress
Online Access:Request full text
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Description
Summary:
DOI:10.1109/IRWS.2001.993928