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DC, AC and Breakdown Simulation of the Gallium Nitride High Electron Mobility Transistor with a Few-Layer Graphene Heat-Removal System
The DC, small-signal AC and breakdown characteristics of the GaN high electron mobility transistor with a few-layer graphene heat-removal system were simulated. The effect of the distance between the gate and the graphene heat-removal element on the device behavior was analyzed. The simulations reve...
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creator | Ha, Dao Dinh Volcheck, Vladislav Stempitsky, Viktor Trung, Tran Tuan |
description | The DC, small-signal AC and breakdown characteristics of the GaN high electron mobility transistor with a few-layer graphene heat-removal system were simulated. The effect of the distance between the gate and the graphene heat-removal element on the device behavior was analyzed. The simulations reveal that extending the graphene layers towards the gate does not influence the DC characteristics but enhances greatly the AC performance quantities. From the other side, a close proximity between the gate and the graphene layers leads to a higher electric field and, consequently, to a reduced breakdown voltage. |
doi_str_mv | 10.1109/ATC55345.2022.9943047 |
format | conference_proceeding |
fullrecord | <record><control><sourceid>ieee_CHZPO</sourceid><recordid>TN_cdi_ieee_primary_9943047</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>9943047</ieee_id><sourcerecordid>9943047</sourcerecordid><originalsourceid>FETCH-LOGICAL-i118t-b3b412b7048a9e03fd5acd52102ea47bbbc88d375c4b0c2a88bbac47cd198f263</originalsourceid><addsrcrecordid>eNotkMtKw0AYhUdBsNQ-gQjzAKbONZksa-xFqAq2rss_yR8zmkuZTC15AZ_bgj2bs_nOtziE3HE25ZylD7NtprVUeiqYENM0VZKp5IJM0sTwONZKc2PMJRkJHouIM5lek0nff7FTEsUkS0bk9ym7p7OMQlvQR4_wXXTHlm5cc6ghuK6lXUlDhXQJde0ODX11wbsC6cp9VnReYx78CXrprKtdGOjWQ9u7PnSeHl2oKNAFHqM1DOjp0sO-wva0RQjROzbdD9R0M_QBmxtyVULd4-TcY_KxmG-zVbR-Wz5ns3XkODchstIqLmzClIEUmSwLDXmhBWcCQSXW2tyYQiY6V5blAoyxFnKV5AVPTSliOSa3_16HiLu9dw34YXd-Tv4BfMxjrg</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>DC, AC and Breakdown Simulation of the Gallium Nitride High Electron Mobility Transistor with a Few-Layer Graphene Heat-Removal System</title><source>IEEE Xplore All Conference Series</source><creator>Ha, Dao Dinh ; Volcheck, Vladislav ; Stempitsky, Viktor ; Trung, Tran Tuan</creator><creatorcontrib>Ha, Dao Dinh ; Volcheck, Vladislav ; Stempitsky, Viktor ; Trung, Tran Tuan</creatorcontrib><description>The DC, small-signal AC and breakdown characteristics of the GaN high electron mobility transistor with a few-layer graphene heat-removal system were simulated. The effect of the distance between the gate and the graphene heat-removal element on the device behavior was analyzed. The simulations reveal that extending the graphene layers towards the gate does not influence the DC characteristics but enhances greatly the AC performance quantities. From the other side, a close proximity between the gate and the graphene layers leads to a higher electric field and, consequently, to a reduced breakdown voltage.</description><identifier>EISSN: 2162-1039</identifier><identifier>EISBN: 9781665451888</identifier><identifier>EISBN: 1665451882</identifier><identifier>DOI: 10.1109/ATC55345.2022.9943047</identifier><language>eng</language><publisher>IEEE</publisher><subject>Behavioral sciences ; Electric breakdown ; Gallium nitride ; Graphene ; heat-removal system ; Heating systems ; HEMTs ; high electron mobility transistor ; Logic gates ; Performance evaluation ; self-heating effect</subject><ispartof>2022 International Conference on Advanced Technologies for Communications (ATC), 2022, p.121-125</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/9943047$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,27925,54555,54932</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/9943047$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Ha, Dao Dinh</creatorcontrib><creatorcontrib>Volcheck, Vladislav</creatorcontrib><creatorcontrib>Stempitsky, Viktor</creatorcontrib><creatorcontrib>Trung, Tran Tuan</creatorcontrib><title>DC, AC and Breakdown Simulation of the Gallium Nitride High Electron Mobility Transistor with a Few-Layer Graphene Heat-Removal System</title><title>2022 International Conference on Advanced Technologies for Communications (ATC)</title><addtitle>ATC</addtitle><description>The DC, small-signal AC and breakdown characteristics of the GaN high electron mobility transistor with a few-layer graphene heat-removal system were simulated. The effect of the distance between the gate and the graphene heat-removal element on the device behavior was analyzed. The simulations reveal that extending the graphene layers towards the gate does not influence the DC characteristics but enhances greatly the AC performance quantities. From the other side, a close proximity between the gate and the graphene layers leads to a higher electric field and, consequently, to a reduced breakdown voltage.</description><subject>Behavioral sciences</subject><subject>Electric breakdown</subject><subject>Gallium nitride</subject><subject>Graphene</subject><subject>heat-removal system</subject><subject>Heating systems</subject><subject>HEMTs</subject><subject>high electron mobility transistor</subject><subject>Logic gates</subject><subject>Performance evaluation</subject><subject>self-heating effect</subject><issn>2162-1039</issn><isbn>9781665451888</isbn><isbn>1665451882</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2022</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><recordid>eNotkMtKw0AYhUdBsNQ-gQjzAKbONZksa-xFqAq2rss_yR8zmkuZTC15AZ_bgj2bs_nOtziE3HE25ZylD7NtprVUeiqYENM0VZKp5IJM0sTwONZKc2PMJRkJHouIM5lek0nff7FTEsUkS0bk9ym7p7OMQlvQR4_wXXTHlm5cc6ghuK6lXUlDhXQJde0ODX11wbsC6cp9VnReYx78CXrprKtdGOjWQ9u7PnSeHl2oKNAFHqM1DOjp0sO-wva0RQjROzbdD9R0M_QBmxtyVULd4-TcY_KxmG-zVbR-Wz5ns3XkODchstIqLmzClIEUmSwLDXmhBWcCQSXW2tyYQiY6V5blAoyxFnKV5AVPTSliOSa3_16HiLu9dw34YXd-Tv4BfMxjrg</recordid><startdate>20221020</startdate><enddate>20221020</enddate><creator>Ha, Dao Dinh</creator><creator>Volcheck, Vladislav</creator><creator>Stempitsky, Viktor</creator><creator>Trung, Tran Tuan</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>20221020</creationdate><title>DC, AC and Breakdown Simulation of the Gallium Nitride High Electron Mobility Transistor with a Few-Layer Graphene Heat-Removal System</title><author>Ha, Dao Dinh ; Volcheck, Vladislav ; Stempitsky, Viktor ; Trung, Tran Tuan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i118t-b3b412b7048a9e03fd5acd52102ea47bbbc88d375c4b0c2a88bbac47cd198f263</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2022</creationdate><topic>Behavioral sciences</topic><topic>Electric breakdown</topic><topic>Gallium nitride</topic><topic>Graphene</topic><topic>heat-removal system</topic><topic>Heating systems</topic><topic>HEMTs</topic><topic>high electron mobility transistor</topic><topic>Logic gates</topic><topic>Performance evaluation</topic><topic>self-heating effect</topic><toplevel>online_resources</toplevel><creatorcontrib>Ha, Dao Dinh</creatorcontrib><creatorcontrib>Volcheck, Vladislav</creatorcontrib><creatorcontrib>Stempitsky, Viktor</creatorcontrib><creatorcontrib>Trung, Tran Tuan</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Xplore</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ha, Dao Dinh</au><au>Volcheck, Vladislav</au><au>Stempitsky, Viktor</au><au>Trung, Tran Tuan</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>DC, AC and Breakdown Simulation of the Gallium Nitride High Electron Mobility Transistor with a Few-Layer Graphene Heat-Removal System</atitle><btitle>2022 International Conference on Advanced Technologies for Communications (ATC)</btitle><stitle>ATC</stitle><date>2022-10-20</date><risdate>2022</risdate><spage>121</spage><epage>125</epage><pages>121-125</pages><eissn>2162-1039</eissn><eisbn>9781665451888</eisbn><eisbn>1665451882</eisbn><abstract>The DC, small-signal AC and breakdown characteristics of the GaN high electron mobility transistor with a few-layer graphene heat-removal system were simulated. The effect of the distance between the gate and the graphene heat-removal element on the device behavior was analyzed. The simulations reveal that extending the graphene layers towards the gate does not influence the DC characteristics but enhances greatly the AC performance quantities. From the other side, a close proximity between the gate and the graphene layers leads to a higher electric field and, consequently, to a reduced breakdown voltage.</abstract><pub>IEEE</pub><doi>10.1109/ATC55345.2022.9943047</doi><tpages>5</tpages></addata></record> |
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issn | 2162-1039 |
language | eng |
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source | IEEE Xplore All Conference Series |
subjects | Behavioral sciences Electric breakdown Gallium nitride Graphene heat-removal system Heating systems HEMTs high electron mobility transistor Logic gates Performance evaluation self-heating effect |
title | DC, AC and Breakdown Simulation of the Gallium Nitride High Electron Mobility Transistor with a Few-Layer Graphene Heat-Removal System |
url | http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-01T17%3A28%3A28IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_CHZPO&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=DC,%20AC%20and%20Breakdown%20Simulation%20of%20the%20Gallium%20Nitride%20High%20Electron%20Mobility%20Transistor%20with%20a%20Few-Layer%20Graphene%20Heat-Removal%20System&rft.btitle=2022%20International%20Conference%20on%20Advanced%20Technologies%20for%20Communications%20(ATC)&rft.au=Ha,%20Dao%20Dinh&rft.date=2022-10-20&rft.spage=121&rft.epage=125&rft.pages=121-125&rft.eissn=2162-1039&rft_id=info:doi/10.1109/ATC55345.2022.9943047&rft.eisbn=9781665451888&rft.eisbn_list=1665451882&rft_dat=%3Cieee_CHZPO%3E9943047%3C/ieee_CHZPO%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-i118t-b3b412b7048a9e03fd5acd52102ea47bbbc88d375c4b0c2a88bbac47cd198f263%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=9943047&rfr_iscdi=true |