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Ni2+ Removal and Recovery from Electroplating Effluent by Pseudomonas putida 5-x Cell Biomass
Ni 2+ and Cu 2+ are the major heavy metal ions in electroplating wastewater of Hong Kong. In the present study, Pseudomonas putida 5-x cell biomass was used to remove Ni 2+ from electroplating effluent. Ni 2+ adsorption capacity of P. putida 5-x cell biomass cultured in sulphate-limiting medium was...
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Published in: | Journal of environmental science and health. Part A, Toxic/hazardous substances & environmental engineering Toxic/hazardous substances & environmental engineering, 2003-04, Vol.38 (3), p.521-531 |
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Main Authors: | , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Online Access: | Get full text |
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Summary: | Ni
2+
and Cu
2+
are the major heavy metal ions in electroplating wastewater of Hong Kong. In the present study, Pseudomonas putida 5-x cell biomass was used to remove Ni
2+
from electroplating effluent. Ni
2+
adsorption capacity of P. putida 5-x cell biomass cultured in sulphate-limiting medium was found to be minimum in early logarithmic growth phase, and maximum of 28.1 mg g
−1
in late stationary growth phase. Pretreated cells by 0.1 mol L
−1
HCl could greatly enhance the Ni
2+
adsorption capacity of cell biomass from 28.1 to 36.7 mg g
−1
and had no significant effect on biomass loss. The adsorption process of P. putida 5-x fresh cells and pretreated cell all could be expressed with Freundlich isotherm. TEM analyses indicated that acidic pretreatment degraded the superficial layer-capsule outside of the fresh cell to improve the adsorption capacity of cell to Ni
2+
. The Ni
2+
bound by P. putida 5-x cell biomass could be efficiently recovered using 0.1 mol L
−1
HCl, and the cell biomass could be reused at least five cycles for Ni
2+
removal and recovery with 93% above removal efficiency and 98% above recovery rate. Owing to the Cu
2+
presented in electroplating wastewater inhibiting Ni
2+
adsorption process by P. putida 5-x cell biomass, two-stage biosorption processes should be designed to remove and recover Cu
2+
and Ni
2+
sequentially from electroplating effluent. |
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ISSN: | 1093-4529 1532-4117 |
DOI: | 10.1081/ESE-120016912 |