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Preparation of chemical dispersion coatings with included boron nitride
Chemical metallisation of cubic boron nitride (cBN) in solutions containing copper ions has been achieved in order to use the metallised hard material for its inclusion in composite materials. It was found to be appropriate to work with smaller fractions of cBN grains, in order to avoid an uneconomi...
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Published in: | Transactions of the Institute of Metal Finishing 2013-03, Vol.91 (2), p.96-100 |
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Main Authors: | , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Chemical metallisation of cubic boron nitride (cBN) in solutions containing copper ions has been achieved in order to use the metallised hard material for its inclusion in composite materials. It was found to be appropriate to work with smaller fractions of cBN grains, in order to avoid an uneconomically long period of electroless copper plating. The possibility of obtaining composite materials by copper chemical plating with included dispersed particles of cubic beta- and alpha hexagonal boron nitride with a grain size range of 50-80 μm for cBN and 1-5 μm respectively for hexagonal boron nitride on flexible materials of the pressed polyethylene terephthalate textile was shown. |
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ISSN: | 0020-2967 1745-9192 |
DOI: | 10.1179/0020296712Z.00000000084 |