Three-Dimensional Thermal Analysis of an SFCL REBCO Coil Immersed in Liquid Nitrogen

A resistive type superconducting fault current limiter (SFCL) using REBCO tapes has shown its advantages in power applications. However, the hotspot problem, which can be caused by the uniformity of critical current density JC over long-length of REBCO tapes, is still a threat to the SFCL safety. In...

Full description

Saved in:
Bibliographic Details
Published in:Journal of physics. Conference series 2018-07, Vol.1054 (1), p.12078
Main Authors: Qian, Kezhen, Shiratani, Toshiki, Terao, Yutaka, Ohsaki, Hiroyuki
Format: Article
Language:English
Subjects:
Coils
Constraining
Critical current density
Current limiters
Degradation
Finite element method
Heat generation
Liquid nitrogen
Physics
Substrates
Superconducting tapes
Thermal analysis
Thermal conductivity
Thermal stability
Three dimensional analysis
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:A resistive type superconducting fault current limiter (SFCL) using REBCO tapes has shown its advantages in power applications. However, the hotspot problem, which can be caused by the uniformity of critical current density JC over long-length of REBCO tapes, is still a threat to the SFCL safety. In this paper, we have studied the limiting performance and transient temperature rise distribution of a nonintersecting type non-inductive solenoidal SFCL REBCO coil using three-dimensional electromagnetic and thermal coupled FEM analysis. Firstly, we modelled a local degradation of JC and studied its influence on the transient temperature rise distribution during the over current. The results indicated that a narrow and severe JC degradation leads to the concentration of current and heat generation in the normal JC area, which is opposite to the case of a relatively wider and slighter JC degradation area. Furthermore, REBCO tapes with different thickness of substrate and Ag over-layer were analysed to study the influence on limiting performance and temperature rise. A thicker substrate leaded to a slower temperature rise because of its higher heat capacity, and the Ag over-layer of 4 μm showed better limiting performance and thermal stability because of its better thermal conductivity as well as uniform temperature rise and SN transition.
ISSN:1742-6588
1742-6596
DOI:10.1088/1742-6596/1054/1/012078