Design of Heat Sink in Power Electronic Device Using Liquid Metal

Most converter valves of IGBT modules use a water-cooling system. The cooling technology of water cooling system is mature and has considerable advantages. However, higher power density power electronics lead to greater cooling power. With the improvement of the heat dissipation power of power elect...

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Bibliographic Details
Published in:IOP conference series. Earth and environmental science 2020-03, Vol.453 (1), p.12061
Main Authors: Zhang, Peng, Han, Ronggang, Wang, Dehui, Yan, Biao
Format: Article
Language:English
Subjects:
Aluminum
Casting
Converters
Cooling
Cooling systems
Copper
Deionization
Electronic devices
Electronic equipment
Heat
heat dissipation technology
Heat sinks
Liquid cooling
Liquid metal
Liquid metals
Mathematical models
Metals
power electronic device
Simulation analysis
Technology assessment
Working conditions
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Summary:Most converter valves of IGBT modules use a water-cooling system. The cooling technology of water cooling system is mature and has considerable advantages. However, higher power density power electronics lead to greater cooling power. With the improvement of the heat dissipation power of power electronic devices, the traditional water cooling system will gradually fail to meet the heat dissipation requirements of power electronic devices, and new cooling systems need to be developed. In this paper, based on the existing traditional water-cooling system model, numerical simulation analysis technology is used to compare and analyze the different cooling materials (copper, aluminum) and cooling medium (water, liquid metal) under the working conditions. For deionized water and liquid metal, the heat dissipation effect is compared and analyzed, which shows that the heat dissipation performance of the heat dissipation system using copper and liquid metal is greatly improved. Based on this, the model of liquid metal heat dissipation system is proposed. Compared with the traditional cooling model, it shows its superiority in heat dissipation performance with highest temperature decreased by 20.4%.
ISSN:1755-1307
1755-1315
DOI:10.1088/1755-1315/453/1/012061