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Study on layer formation behavior of Ag joints sintered with pressureless sintering process

This study focuses on investigating the relationship between sintering performance and bond layer thickness for the hybrid Ag paste consisting of micrometer-sized Ag particles and sub-micrometer Ag spherical particles. The surface morphology showed that the sub-micrometer Ag particles would contribu...

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Published in:Materials research express 2022-11, Vol.9 (11), p.116512
Main Authors: Wang, Liujue, Ding, Taojie, Gu, Lin, Sun, Xiaodong
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Gu, Lin
Sun, Xiaodong
description This study focuses on investigating the relationship between sintering performance and bond layer thickness for the hybrid Ag paste consisting of micrometer-sized Ag particles and sub-micrometer Ag spherical particles. The surface morphology showed that the sub-micrometer Ag particles would contribute to improving the densification and bonding strength of the sintered Ag joint. The x-ray results indicated that the bonding quality was achieved when the bonding layer thickness was 50 μ m, whereas a thinner or thicker bonding layer would lead to cracks or voids. Moreover, the microstructure of sintered Ag joints with different bonding layer thicknesses was found to be in good agreement with the results of x-ray by SEM observations. There are many cracks in the sintering structure due to the insufficient Ag paste when the bonding layer thickness is below 50 μ m, while more voids appeared in sintered Ag joints when the thickness reached 120 μ m, which was caused by the organic solvent volatilization. In addition, the poor densifications lead to low strengths of 7.6 MPa and 23.42 MPa for 15 μ m and 30 μ m thickness, respectively. The shear test results revealed that the highest shear strength was achieved on the bonding layer with a 50 μ m-thick bonding layer. However, the bonding strength would decrease to 24.67 MPa and 18.64 MPa when the bonding layer thickness was 90 μ m and 120 μ m, respectively. The SEM observations indicated that many dimples were formed on the fracture surface with a thickness of 50 μ m, which was the reason for the enhancement of bonding strength in the sintered Ag joint.
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The surface morphology showed that the sub-micrometer Ag particles would contribute to improving the densification and bonding strength of the sintered Ag joint. The x-ray results indicated that the bonding quality was achieved when the bonding layer thickness was 50 μ m, whereas a thinner or thicker bonding layer would lead to cracks or voids. Moreover, the microstructure of sintered Ag joints with different bonding layer thicknesses was found to be in good agreement with the results of x-ray by SEM observations. There are many cracks in the sintering structure due to the insufficient Ag paste when the bonding layer thickness is below 50 μ m, while more voids appeared in sintered Ag joints when the thickness reached 120 μ m, which was caused by the organic solvent volatilization. In addition, the poor densifications lead to low strengths of 7.6 MPa and 23.42 MPa for 15 μ m and 30 μ m thickness, respectively. The shear test results revealed that the highest shear strength was achieved on the bonding layer with a 50 μ m-thick bonding layer. However, the bonding strength would decrease to 24.67 MPa and 18.64 MPa when the bonding layer thickness was 90 μ m and 120 μ m, respectively. The SEM observations indicated that many dimples were formed on the fracture surface with a thickness of 50 μ m, which was the reason for the enhancement of bonding strength in the sintered Ag joint.</description><identifier>ISSN: 2053-1591</identifier><identifier>EISSN: 2053-1591</identifier><identifier>DOI: 10.1088/2053-1591/ac9d84</identifier><language>eng</language><publisher>Bristol: IOP Publishing</publisher><subject>bond layer thickness ; Bonded joints ; Bonding strength ; Densification ; Dimpling ; Fracture surfaces ; hybrid Ag paste ; Loose powder sintering ; microstructure ; Rapid prototyping ; Shear strength ; Shear tests ; Sintering ; Thickness</subject><ispartof>Materials research express, 2022-11, Vol.9 (11), p.116512</ispartof><rights>2022 The Author(s). Published by IOP Publishing Ltd</rights><rights>2022 The Author(s). Published by IOP Publishing Ltd. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). 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Res. Express</addtitle><description>This study focuses on investigating the relationship between sintering performance and bond layer thickness for the hybrid Ag paste consisting of micrometer-sized Ag particles and sub-micrometer Ag spherical particles. The surface morphology showed that the sub-micrometer Ag particles would contribute to improving the densification and bonding strength of the sintered Ag joint. The x-ray results indicated that the bonding quality was achieved when the bonding layer thickness was 50 μ m, whereas a thinner or thicker bonding layer would lead to cracks or voids. Moreover, the microstructure of sintered Ag joints with different bonding layer thicknesses was found to be in good agreement with the results of x-ray by SEM observations. There are many cracks in the sintering structure due to the insufficient Ag paste when the bonding layer thickness is below 50 μ m, while more voids appeared in sintered Ag joints when the thickness reached 120 μ m, which was caused by the organic solvent volatilization. In addition, the poor densifications lead to low strengths of 7.6 MPa and 23.42 MPa for 15 μ m and 30 μ m thickness, respectively. The shear test results revealed that the highest shear strength was achieved on the bonding layer with a 50 μ m-thick bonding layer. However, the bonding strength would decrease to 24.67 MPa and 18.64 MPa when the bonding layer thickness was 90 μ m and 120 μ m, respectively. 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subjects bond layer thickness
Bonded joints
Bonding strength
Densification
Dimpling
Fracture surfaces
hybrid Ag paste
Loose powder sintering
microstructure
Rapid prototyping
Shear strength
Shear tests
Sintering
Thickness
title Study on layer formation behavior of Ag joints sintered with pressureless sintering process
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