(Invited) High Accuracy Aligned Wafer Bonding for Wafer-Level Integration

This paper aims to present an overview of the existing wafer-to-wafer alignment technology. The development of optical alignment methods will be reviewed with respect to applications requirements evolution over time. An overview of the different factors contributing to the overall misalignment budge...

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Bibliographic Details
Main Authors: Plach, Thomas, Rebhan, Bernhard, Dragoi, Viorel, Wagenleitner, Thomas, Wimplinger, Markus, Lindner, Paul
Format: Conference Proceeding
Language:English
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Summary:This paper aims to present an overview of the existing wafer-to-wafer alignment technology. The development of optical alignment methods will be reviewed with respect to applications requirements evolution over time. An overview of the different factors contributing to the overall misalignment budget and how they are controlled now, or will be in the future, in order to meet the stringent requirements will be presented with examples.
ISSN:1938-5862
1938-6737
1938-6737
1938-5862
DOI:10.1149/08605.0145ecst