Communication-Localized Accelerator Pre-Adsorption to Speed Up Copper Electroplating Microvia Filling

A practical fast microvia filling method in copper electroplating is developed with the aid of bottom-localized pre-adsorption of bis(3-sulfopropy)-disulfide (SPS). The pretreatment initiates with accelerator adsorbed at all copper surface. Subsequently, the adsorbed SPS on board surface is broken d...

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Bibliographic Details
Published in:Journal of the Electrochemical Society 2019, Vol.166 (10), p.D467-D469
Main Authors: Zhu, Kai, Wang, Chong, Wang, Shouxu, Chen, Yuanming, Zhou, Guoyun, Hong, Yan, He, Wei, Zhou, Jinqun, Miao, Hua, Wen, Zesheng
Format: Article
Language:English
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Summary:A practical fast microvia filling method in copper electroplating is developed with the aid of bottom-localized pre-adsorption of bis(3-sulfopropy)-disulfide (SPS). The pretreatment initiates with accelerator adsorbed at all copper surface. Subsequently, the adsorbed SPS on board surface is broken down by sodium persulfate, but the function of adsorbed SPS at microvia bottom is mostly retained due to the mass transfer limitation. The pre-adsorbed SPS at microvia bottom improves the accumulation of SPS at microvia bottom in electroplating filling, resulting in the speeding up of microvia filling.
ISSN:0013-4651
1945-7111
DOI:10.1149/2.0041912jes