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Use of anti-solvent to enhance thermoelectric response of hybrid halide perovskite thin films
Hybrid halide perovskite research has recently been focused on thermoelectric energy harvesting due to the cost-effectiveness of the fabrication approach and to the ultra-low thermal conductivity. To achieve high performance, tuning of the electrical conductivity is a key parameter that is influence...
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Published in: | Japanese Journal of Applied Physics 2022-06, Vol.61 (SE), p.SE1019 |
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Main Authors: | , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Hybrid halide perovskite research has recently been focused on thermoelectric energy harvesting due to the cost-effectiveness of the fabrication approach and to the ultra-low thermal conductivity. To achieve high performance, tuning of the electrical conductivity is a key parameter that is influenced by grain boundary scattering and charge carrier density. The fabrication process allows the tuning of these parameters. We report the use of anti-solvent to enhance the thermoelectric performance of lead-free hybrid halide perovskite (CH
3
NH
3
SnI
3
) thin films. Thin films with anti-solvent show higher connectivity in grains and higher Sn
+4
oxidation states which result in the enhancement of the value of electrical conductivity. The thin films were prepared by a cost-effective wet process. Structural and chemical characterizations were performed using X-ray diffraction, scanning electron microscopy, and X-ray photoelectron spectroscopy. The values of electrical conductivity and the Seebeck coefficient were measured near room temperature. A high value of the power factor (1.55
μ
W m
−1
K
−2
at 320 K) was achieved for thin films treated with anti-solvent. |
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ISSN: | 0021-4922 1347-4065 |
DOI: | 10.35848/1347-4065/ac4adb |