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Use of anti-solvent to enhance thermoelectric response of hybrid halide perovskite thin films

Hybrid halide perovskite research has recently been focused on thermoelectric energy harvesting due to the cost-effectiveness of the fabrication approach and to the ultra-low thermal conductivity. To achieve high performance, tuning of the electrical conductivity is a key parameter that is influence...

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Bibliographic Details
Published in:Japanese Journal of Applied Physics 2022-06, Vol.61 (SE), p.SE1019
Main Authors: Saini, Shrikant, Matsumoto, Izuki, Kishishita, Sakura, Baranwal, Ajay Kumar, Yabuki, Tomohide, Hayase, Shuzi, Miyazaki, Koji
Format: Article
Language:English
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Summary:Hybrid halide perovskite research has recently been focused on thermoelectric energy harvesting due to the cost-effectiveness of the fabrication approach and to the ultra-low thermal conductivity. To achieve high performance, tuning of the electrical conductivity is a key parameter that is influenced by grain boundary scattering and charge carrier density. The fabrication process allows the tuning of these parameters. We report the use of anti-solvent to enhance the thermoelectric performance of lead-free hybrid halide perovskite (CH 3 NH 3 SnI 3 ) thin films. Thin films with anti-solvent show higher connectivity in grains and higher Sn +4 oxidation states which result in the enhancement of the value of electrical conductivity. The thin films were prepared by a cost-effective wet process. Structural and chemical characterizations were performed using X-ray diffraction, scanning electron microscopy, and X-ray photoelectron spectroscopy. The values of electrical conductivity and the Seebeck coefficient were measured near room temperature. A high value of the power factor (1.55 μ W m −1 K −2 at 320 K) was achieved for thin films treated with anti-solvent.
ISSN:0021-4922
1347-4065
DOI:10.35848/1347-4065/ac4adb