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Substrate bonding techniques for CMOS processed wafers
Transferring a CMOS circuit to a foreign substrate can be accomplished by bonding a processed silicon wafer to the substrate and subsequently thinning the silicon wafer. This paper presents both anodic bonding and adhesive bonding and evaluates their potential for circuit transfer.
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Published in: | Journal of micromechanics and microengineering 1997-09, Vol.7 (3), p.108-110 |
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Main Authors: | , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Transferring a CMOS circuit to a foreign substrate can be accomplished by bonding a processed silicon wafer to the substrate and subsequently thinning the silicon wafer. This paper presents both anodic bonding and adhesive bonding and evaluates their potential for circuit transfer. |
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ISSN: | 0960-1317 1361-6439 |
DOI: | 10.1088/0960-1317/7/3/006 |