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Substrate bonding techniques for CMOS processed wafers

Transferring a CMOS circuit to a foreign substrate can be accomplished by bonding a processed silicon wafer to the substrate and subsequently thinning the silicon wafer. This paper presents both anodic bonding and adhesive bonding and evaluates their potential for circuit transfer.

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Bibliographic Details
Published in:Journal of micromechanics and microengineering 1997-09, Vol.7 (3), p.108-110
Main Authors: Groen, S van der, Rosmeulen, M, Baert, K, Jansen, P, Deferm, L
Format: Article
Language:English
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Description
Summary:Transferring a CMOS circuit to a foreign substrate can be accomplished by bonding a processed silicon wafer to the substrate and subsequently thinning the silicon wafer. This paper presents both anodic bonding and adhesive bonding and evaluates their potential for circuit transfer.
ISSN:0960-1317
1361-6439
DOI:10.1088/0960-1317/7/3/006