Analysis of GaN Damage Induced by Cl2/SiCl4/Ar Plasma

• Published in: Jpn J Appl Phys 2011-08, Vol.50 (8), p.08JE03-08JE03-4
• Main Authors: Minami, Masaki, Tomiya, Shigetaka, Ishikawa, Kenji, Matsumoto, Ryosuke, Chen, Shang, Fukasawa, Masanaga, Uesawa, Fumikatsu, Sekine, Makoto, Hori, Masaru, Tatsumi, Tetsuya
• Format: Article
• Language: eng ; jpn
• ISSN: 0021-4922; 1347-4065
• DOI: 10.1143/JJAP.50.08JE03

GaN-based optical devices are fabricated using a GaN/InGaN/GaN sandwiched structure. The effect of radicals, ions, and UV light on the GaN optical properties during Cl 2 /SiCl 4 /Ar plasma etching was evaluated using photoluminescence (PL) analysis. The samples were exposed to plasma (radicals, ions, and UV light) using an inductively coupled plasma (ICP) etching system and a plasma ion beam apparatus that can separate the effects of UV and ions both with and without covering the SiO 2 window on the surface. Etching damage in an InGaN single quantum well (SQW) was formed by exposing the sample to plasma. The damage, which decreases PL emission intensity, was generated not only by ion beam irradiation but also by UV light irradiation. PL intensity decreased when the thickness of the upper GaN layer was etched to less than 60 nm. In addition, simultaneous irradiation of UV light and ions slightly increased the degree of damage. There seems to be a synergistic effect between the UV light and the ions. For high-quality GaN-based optoelectronics and power devices, UV light must be controlled during etching processes in addition to the etching profile, selectivity, and ion bombardment damage.