Highperformance substrate from new epoxy resin and enhanced copper foil

The Dow Chemical Company has developed a new epoxybased system to serve the growing need for highperformance dielectric substrates, requiring high thermal reliability high Tg, high thermal resistance and high signal speed and integrity low dielectric constant and low loss factor. The system is based...

Full description

Saved in:
Bibliographic Details
Published in:Circuit world 2004-12, Vol.30 (4), p.20-26
Main Authors: Valette, Ludovic, Wiechmann, Rudolf
Format: Article
Language:English
Subjects:
Adhesion
Epoxy resins
Thermal stability
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The Dow Chemical Company has developed a new epoxybased system to serve the growing need for highperformance dielectric substrates, requiring high thermal reliability high Tg, high thermal resistance and high signal speed and integrity low dielectric constant and low loss factor. The system is based on advanced, proprietary resin technologies. The process latitude of this system is very similar to traditional high Tg FR4 products. The optimized rheology of the system leads to consistent, controlled flow. The copper foil JTCHTEAB from Gould Electronics, where AB stands for advanced bond, is interesting in this context as it was developed for use on highperformance laminates with a typically lower ability for copper bonding, such as high Tg and low DkDf substrates. When the LDkHTd resin is used in combination with the JTCHTEAB copper foil, the copper peel strength fully meets the industry standard for high Tg FR4 laminates.
ISSN:0305-6120
DOI:10.1108/03056120410539876