A lowcost solderbumped chip scale package NuCSP

A new solderbumped flip chip land grid array LGA chip scale package CSP called NuCSP is presented in this paper. NuCSP is a minimized body size package with a rigid substrate interposer. The design concept is to utilize the interposer to redistribute the very fine pitch peripheral pads on the solder...

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Bibliographic Details
Published in:Circuit world 1998-09, Vol.24 (3), p.11-25
Main Authors: Lau, John H., Chang, Chris, Chen, Tony, Cheng, David, Lao, Eric
Format: Article
Language:English
Subjects:
Chip size package
Packaging
Printed circuits
Solders
Online Access:Get full text
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Summary:A new solderbumped flip chip land grid array LGA chip scale package CSP called NuCSP is presented in this paper. NuCSP is a minimized body size package with a rigid substrate interposer. The design concept is to utilize the interposer to redistribute the very fine pitch peripheral pads on the solderbumped chip to much larger pitch areaarray pads on the printed circuit board PCB. Using conventional PCB substrate manufacturing processes, NuCSP offers a very lowcost package suitable for memory chips and low pincount applicationspecific ICs ASICs. Also, NuCSP is surface mount technology SMT compatible and can be joined to the PCB with a 6mil 0.15mm thick 63wt Sn37 Pb solder paste.
ISSN:0305-6120
DOI:10.1108/03056129810208429