A Reliability Study of Fuzz Button Interconnects

This paper presents the methods and results of load, deflection and electrical contact resistance experiments for reliable electronic module design using fuzz button technology. Both beryllium copper (BeCu) and molybdenum (Mo) fuzz button contacts were examined, as a function of wire diameter, butto...

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Bibliographic Details
Published in:Circuit world 1995-02, Vol.21 (2), p.12-18
Main Authors: Harris, D.B., Pecht, M.G.
Format: Article
Language:English
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Summary:This paper presents the methods and results of load, deflection and electrical contact resistance experiments for reliable electronic module design using fuzz button technology. Both beryllium copper (BeCu) and molybdenum (Mo) fuzz button contacts were examined, as a function of wire diameter, button diameter and button density.
ISSN:0305-6120
1758-602X
DOI:10.1108/eb046298