Loading…
Cost and production analysis for substrates with embedded passives
With the advent of new materials and technologies that enable passive components to be embedded within electronic substrates, one key question that arises is: under what circumstances (and for what type of applications) is it economically viable to consider using embedded passives? The economic issu...
Saved in:
Published in: | Circuit world 2004-03, Vol.30 (1), p.25-30 |
---|---|
Main Authors: | , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
cited_by | cdi_FETCH-LOGICAL-c364t-ae05263b36ec018ebde5dea0f73490684cf1a59bcd20738e8e5a8e9b88fb87513 |
---|---|
cites | cdi_FETCH-LOGICAL-c364t-ae05263b36ec018ebde5dea0f73490684cf1a59bcd20738e8e5a8e9b88fb87513 |
container_end_page | 30 |
container_issue | 1 |
container_start_page | 25 |
container_title | Circuit world |
container_volume | 30 |
creator | Sandborn, Peter A. Etienne, Bevin Herrmann, Jeffrey W. Chincholkar, Mandar M. |
description | With the advent of new materials and technologies that enable passive components to be embedded within electronic substrates, one key question that arises is: under what circumstances (and for what type of applications) is it economically viable to consider using embedded passives? The economic issues that must be considered consist of a combination of manufacturing costs and throughputs, and non-manufacturing life cycle costs. This paper discusses the assessment of manufacturing costs associated with embedding resistors and capacitors in printed circuit boards and provides cost modeling results for an avionics board. The discussion is extended to include optimizing the specific embedded passive content in a board and design for production modeling when embedded passives are present. Life cycle cost issues are also qualitatively discussed. |
doi_str_mv | 10.1108/03056120410496351 |
format | article |
fullrecord | <record><control><sourceid>proquest_istex</sourceid><recordid>TN_cdi_istex_primary_ark_67375_4W2_PVH975GV_N</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>431617701</sourcerecordid><originalsourceid>FETCH-LOGICAL-c364t-ae05263b36ec018ebde5dea0f73490684cf1a59bcd20738e8e5a8e9b88fb87513</originalsourceid><addsrcrecordid>eNp90E1P3DAQBmCraqVut_yA3qIe6KUpYzv-yBFWha2EgAMs3Cwnnqih2c3iSfj493i1iANQTiNrnnc0Hsa-cfjFOdg9kKA0F1BwKEotFf_AJtwom2sQVx_ZZNPPN-Az-0J0DQBSCT5hB7OehsyvQraOfRjroe1X6em7B2opa_qY0VjREP2AlN21w98MlxWGgCngidpbpK_sU-M7wp2nOmUXh7_PZ_P8-PToz2z_OK-lLobcIyihZSU11sAtVgFVQA-NkUUJ2hZ1w70qqzoIMNKiReUtlpW1TWWN4nLKfmznpk1vRqTBLVuqsev8CvuRnCkkWChLkeTuu1JYIblKfsq-v4DX_RjT75PhpVLSGJ0Q36I69kQRG7eO7dLHB8fBbY7vXh0_ZfJtpqUB758DPv5z2kijXHEp3NliXhp1tHAnyf_celxi9F14Trwa7dahSRze5v_f6BEyoKCj</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>219553776</pqid></control><display><type>article</type><title>Cost and production analysis for substrates with embedded passives</title><source>ABI/INFORM Global (ProQuest)</source><source>Emerald:Jisc Collections:Emerald Subject Collections HE and FE 2024-2026:Emerald Premier (reading list)</source><creator>Sandborn, Peter A. ; Etienne, Bevin ; Herrmann, Jeffrey W. ; Chincholkar, Mandar M.</creator><creatorcontrib>Sandborn, Peter A. ; Etienne, Bevin ; Herrmann, Jeffrey W. ; Chincholkar, Mandar M.</creatorcontrib><description>With the advent of new materials and technologies that enable passive components to be embedded within electronic substrates, one key question that arises is: under what circumstances (and for what type of applications) is it economically viable to consider using embedded passives? The economic issues that must be considered consist of a combination of manufacturing costs and throughputs, and non-manufacturing life cycle costs. This paper discusses the assessment of manufacturing costs associated with embedding resistors and capacitors in printed circuit boards and provides cost modeling results for an avionics board. The discussion is extended to include optimizing the specific embedded passive content in a board and design for production modeling when embedded passives are present. Life cycle cost issues are also qualitatively discussed.</description><identifier>ISSN: 0305-6120</identifier><identifier>EISSN: 1758-602X</identifier><identifier>EISSN: 0305-6120</identifier><identifier>DOI: 10.1108/03056120410496351</identifier><identifier>CODEN: CIWODV</identifier><language>eng</language><publisher>Bradford: Emerald Group Publishing Limited</publisher><subject>Component parts ; Cost analysis ; Cost control ; Economic analysis ; Economic impact ; Electrical components ; Manufacturing ; Materials ; Printed circuit boards ; Production costs ; Studies</subject><ispartof>Circuit world, 2004-03, Vol.30 (1), p.25-30</ispartof><rights>Emerald Group Publishing Limited</rights><rights>Copyright MCB UP Limited (MCB) 2004</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c364t-ae05263b36ec018ebde5dea0f73490684cf1a59bcd20738e8e5a8e9b88fb87513</citedby><cites>FETCH-LOGICAL-c364t-ae05263b36ec018ebde5dea0f73490684cf1a59bcd20738e8e5a8e9b88fb87513</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://www.proquest.com/docview/219553776?pq-origsite=primo$$EHTML$$P50$$Gproquest$$H</linktohtml><link.rule.ids>314,780,784,11687,27923,27924,36059,36060,44362</link.rule.ids></links><search><creatorcontrib>Sandborn, Peter A.</creatorcontrib><creatorcontrib>Etienne, Bevin</creatorcontrib><creatorcontrib>Herrmann, Jeffrey W.</creatorcontrib><creatorcontrib>Chincholkar, Mandar M.</creatorcontrib><title>Cost and production analysis for substrates with embedded passives</title><title>Circuit world</title><description>With the advent of new materials and technologies that enable passive components to be embedded within electronic substrates, one key question that arises is: under what circumstances (and for what type of applications) is it economically viable to consider using embedded passives? The economic issues that must be considered consist of a combination of manufacturing costs and throughputs, and non-manufacturing life cycle costs. This paper discusses the assessment of manufacturing costs associated with embedding resistors and capacitors in printed circuit boards and provides cost modeling results for an avionics board. The discussion is extended to include optimizing the specific embedded passive content in a board and design for production modeling when embedded passives are present. Life cycle cost issues are also qualitatively discussed.</description><subject>Component parts</subject><subject>Cost analysis</subject><subject>Cost control</subject><subject>Economic analysis</subject><subject>Economic impact</subject><subject>Electrical components</subject><subject>Manufacturing</subject><subject>Materials</subject><subject>Printed circuit boards</subject><subject>Production costs</subject><subject>Studies</subject><issn>0305-6120</issn><issn>1758-602X</issn><issn>0305-6120</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2004</creationdate><recordtype>article</recordtype><sourceid>M0C</sourceid><recordid>eNp90E1P3DAQBmCraqVut_yA3qIe6KUpYzv-yBFWha2EgAMs3Cwnnqih2c3iSfj493i1iANQTiNrnnc0Hsa-cfjFOdg9kKA0F1BwKEotFf_AJtwom2sQVx_ZZNPPN-Az-0J0DQBSCT5hB7OehsyvQraOfRjroe1X6em7B2opa_qY0VjREP2AlN21w98MlxWGgCngidpbpK_sU-M7wp2nOmUXh7_PZ_P8-PToz2z_OK-lLobcIyihZSU11sAtVgFVQA-NkUUJ2hZ1w70qqzoIMNKiReUtlpW1TWWN4nLKfmznpk1vRqTBLVuqsev8CvuRnCkkWChLkeTuu1JYIblKfsq-v4DX_RjT75PhpVLSGJ0Q36I69kQRG7eO7dLHB8fBbY7vXh0_ZfJtpqUB758DPv5z2kijXHEp3NliXhp1tHAnyf_celxi9F14Trwa7dahSRze5v_f6BEyoKCj</recordid><startdate>20040301</startdate><enddate>20040301</enddate><creator>Sandborn, Peter A.</creator><creator>Etienne, Bevin</creator><creator>Herrmann, Jeffrey W.</creator><creator>Chincholkar, Mandar M.</creator><general>Emerald Group Publishing Limited</general><scope>BSCLL</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>0U~</scope><scope>1-H</scope><scope>7SP</scope><scope>7TA</scope><scope>7WY</scope><scope>7WZ</scope><scope>7XB</scope><scope>8AO</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BEZIV</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>DWQXO</scope><scope>F28</scope><scope>FR3</scope><scope>F~G</scope><scope>GNUQQ</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>K6~</scope><scope>L.-</scope><scope>L.0</scope><scope>L7M</scope><scope>M0C</scope><scope>M2P</scope><scope>P5Z</scope><scope>P62</scope><scope>PQBIZ</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>Q9U</scope><scope>S0W</scope></search><sort><creationdate>20040301</creationdate><title>Cost and production analysis for substrates with embedded passives</title><author>Sandborn, Peter A. ; Etienne, Bevin ; Herrmann, Jeffrey W. ; Chincholkar, Mandar M.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c364t-ae05263b36ec018ebde5dea0f73490684cf1a59bcd20738e8e5a8e9b88fb87513</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2004</creationdate><topic>Component parts</topic><topic>Cost analysis</topic><topic>Cost control</topic><topic>Economic analysis</topic><topic>Economic impact</topic><topic>Electrical components</topic><topic>Manufacturing</topic><topic>Materials</topic><topic>Printed circuit boards</topic><topic>Production costs</topic><topic>Studies</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Sandborn, Peter A.</creatorcontrib><creatorcontrib>Etienne, Bevin</creatorcontrib><creatorcontrib>Herrmann, Jeffrey W.</creatorcontrib><creatorcontrib>Chincholkar, Mandar M.</creatorcontrib><collection>Istex</collection><collection>CrossRef</collection><collection>Global News & ABI/Inform Professional</collection><collection>Trade PRO</collection><collection>Electronics & Communications Abstracts</collection><collection>Materials Business File</collection><collection>ABI/INFORM Collection</collection><collection>ABI/INFORM Global (PDF only)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>ProQuest Pharma Collection</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central</collection><collection>Advanced Technologies & Aerospace Database (1962 - current)</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Business Premium Collection</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Central Korea</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>ABI/INFORM Global (Corporate)</collection><collection>ProQuest Central Student</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>ProQuest Business Collection</collection><collection>ABI/INFORM Professional Advanced</collection><collection>ABI/INFORM Professional Standard</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ABI/INFORM Global (ProQuest)</collection><collection>Science Database</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>ProQuest One Business</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central Basic</collection><collection>DELNET Engineering & Technology Collection</collection><jtitle>Circuit world</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Sandborn, Peter A.</au><au>Etienne, Bevin</au><au>Herrmann, Jeffrey W.</au><au>Chincholkar, Mandar M.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Cost and production analysis for substrates with embedded passives</atitle><jtitle>Circuit world</jtitle><date>2004-03-01</date><risdate>2004</risdate><volume>30</volume><issue>1</issue><spage>25</spage><epage>30</epage><pages>25-30</pages><issn>0305-6120</issn><eissn>1758-602X</eissn><eissn>0305-6120</eissn><coden>CIWODV</coden><abstract>With the advent of new materials and technologies that enable passive components to be embedded within electronic substrates, one key question that arises is: under what circumstances (and for what type of applications) is it economically viable to consider using embedded passives? The economic issues that must be considered consist of a combination of manufacturing costs and throughputs, and non-manufacturing life cycle costs. This paper discusses the assessment of manufacturing costs associated with embedding resistors and capacitors in printed circuit boards and provides cost modeling results for an avionics board. The discussion is extended to include optimizing the specific embedded passive content in a board and design for production modeling when embedded passives are present. Life cycle cost issues are also qualitatively discussed.</abstract><cop>Bradford</cop><pub>Emerald Group Publishing Limited</pub><doi>10.1108/03056120410496351</doi><tpages>6</tpages></addata></record> |
fulltext | fulltext |
identifier | ISSN: 0305-6120 |
ispartof | Circuit world, 2004-03, Vol.30 (1), p.25-30 |
issn | 0305-6120 1758-602X 0305-6120 |
language | eng |
recordid | cdi_istex_primary_ark_67375_4W2_PVH975GV_N |
source | ABI/INFORM Global (ProQuest); Emerald:Jisc Collections:Emerald Subject Collections HE and FE 2024-2026:Emerald Premier (reading list) |
subjects | Component parts Cost analysis Cost control Economic analysis Economic impact Electrical components Manufacturing Materials Printed circuit boards Production costs Studies |
title | Cost and production analysis for substrates with embedded passives |
url | http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T07%3A19%3A29IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_istex&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Cost%20and%20production%20analysis%20for%20substrates%20with%20embedded%20passives&rft.jtitle=Circuit%20world&rft.au=Sandborn,%20Peter%20A.&rft.date=2004-03-01&rft.volume=30&rft.issue=1&rft.spage=25&rft.epage=30&rft.pages=25-30&rft.issn=0305-6120&rft.eissn=1758-602X&rft.coden=CIWODV&rft_id=info:doi/10.1108/03056120410496351&rft_dat=%3Cproquest_istex%3E431617701%3C/proquest_istex%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c364t-ae05263b36ec018ebde5dea0f73490684cf1a59bcd20738e8e5a8e9b88fb87513%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=219553776&rft_id=info:pmid/&rfr_iscdi=true |