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Three‐dimensional reconstruction by scanning electron microscopyfrom serial epoxy resin semi‐thin sections after ion‐etching

Three‐dimensional reconstruction was performed using scanning electron micrographs of serial semi‐thin sections of Epon embedded specimens. Connective tissue in a rabbit ear chamber was fixed in glutaraldehyde and osmium tetroxide, and then embedded in Epon. One‐µm‐thick serial sections were cut wit...

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Bibliographic Details
Published in:Journal of electron microscopy 2001-01, Vol.50 (1), p.51-55
Main Authors: Shimizu, Daisaburo, Fujiwara, Takashi, Kon, Kazunori, Isshiki, Nobuko, Tsunokuni, Hideaki
Format: Article
Language:English
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Summary:Three‐dimensional reconstruction was performed using scanning electron micrographs of serial semi‐thin sections of Epon embedded specimens. Connective tissue in a rabbit ear chamber was fixed in glutaraldehyde and osmium tetroxide, and then embedded in Epon. One‐µm‐thick serial sections were cut with a diamond knife, mounted on glass slides and stained with toluidine blue. After observation with a light microscope, the sections were ion‐etched with an ion‐spatter coater. Following double staining with uranyl acetate and lead citrate, the consecutive sections were ion‐coated with platinum. Each serial section was photographed with a scanning electron microscope. Profiles of a blood vessel and fibroblasts were digitized with a computer and computer reconstruction of the blood vessel was performed. Three‐dimensional reconstructions showed that the newly formed blood vessel was a cylinder‐like, bare endothelial tube with a rather smooth outer surface. Fibroblasts were situated around the endothelial tube. Several openings were found in the endothelial tube, suggesting the morphological feature of high permeability and fragility in newly formed blood vessels. The availability of three‐dimensional reconstruction from scanning electron micrographs of serial semi‐thin epoxy resin sections was discussed; structures of interest can be reconstructed (1) quickly and easily, (2) without skilful techniques, and (3) almost at the level of ultrastructure.
ISSN:0022-0744
1477-9986
DOI:10.1093/jmicro/50.1.51