Electrical modeling of ball grid array packages based on one-port S-parameter measurement for electrical evaluation of high-speed test board

To electrically characterize ball grid array (BGA) packages, one-port S-parameter measurements have been performed. Equivalent circuit parameters using the Γ and T models are extracted from measured S-parameters for three different frequency ranges. The accuracy of two selected equivalent circuits i...

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Bibliographic Details
Published in:Current applied physics 2005, 5(3), , pp.271-276
Main Authors: Nam, Seungki, Lee, Jaehoon, Kim, Yonggyoo, Tchah, Kyun-Hyun, Jeong, Jaeyong, Jeong, Jichai
Format: Article
Language:English
Subjects:
Capacitances
Circuit modeling
Inductances
Packaging
물리학
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Description
Summary:To electrically characterize ball grid array (BGA) packages, one-port S-parameter measurements have been performed. Equivalent circuit parameters using the Γ and T models are extracted from measured S-parameters for three different frequency ranges. The accuracy of two selected equivalent circuits is evaluated by comparison between the re-calculated S 11 using the extracted equivalent circuit parameters and measured S-parameters. The results show that the T lumped model can be used to represent S-parameters of BGA packages without distributed elements up to 2 GHz.
ISSN:1567-1739
1878-1675
DOI:10.1016/j.cap.2003.09.025