Effect of a Pd sacrifice layer on the interfacial reaction in Sn-3.5Ag/Pd/Cu

The effect of a Pd layer on the interfacial reaction in Sn-3.5Ag/Pd/Cu was studied by varying the thickness of the Pd layer. The formation of PdSn 4 , (Pd 1− x Cu x )Sn 4 , and (Cu 1− y Pd y ) 6 Sn 5 intermetallic compounds (IMCs), along with CuSn IMCs, was observed. The Sn-3.5Ag/Pd/Cu structure did...

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Bibliographic Details
Published in:Journal of the Korean Physical Society 2012, 61(8), , pp.1263-1266
Main Authors: Na, Seong-Hun, Kim, Jin-Soo, Lim, Seung-Kyu, Suh, Su-Jeong
Format: Article
Language:English
Subjects:
Mathematical and Computational Physics
Particle and Nuclear Physics
Physics
Physics and Astronomy
Research Papers
Theoretical
물리학
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Summary:The effect of a Pd layer on the interfacial reaction in Sn-3.5Ag/Pd/Cu was studied by varying the thickness of the Pd layer. The formation of PdSn 4 , (Pd 1− x Cu x )Sn 4 , and (Cu 1− y Pd y ) 6 Sn 5 intermetallic compounds (IMCs), along with CuSn IMCs, was observed. The Sn-3.5Ag/Pd/Cu structure did not suppress the growth of the (Cu 1− y Pd y ) 6 Sn 5 IMCs, but the growth of Cu 3 Sn IMCs was inhibited by the presence of a 200- to 600-nm-thick Pd layer.
ISSN:0374-4884
1976-8524
DOI:10.3938/jkps.61.1263