Heat dissipation properties of polyimide nanocomposite films

• Published in: The Korean journal of chemical engineering 2016, 33(11), 200, pp.3245-3250
• Main Authors: Kim, Jinyoung, Kwon, Jinuk, Lee, Daero, Kim, Myeongsoo, Han, Haksoo
• Format: Article
• Language: English
• Subjects: Biotechnology; Catalysis; Chemistry; Chemistry and Materials Science; Electronic; Industrial Chemistry/Chemical Engineering; Inorganic; Materials (Organic; Materials Science; Nanocomposites; Thermal conductivity; Thermal decomposition; Thermal resistance; Thermal stability; Thermodynamic properties; Thin Films; 화학공학
• ISSN: 0256-1115; 1975-7220
• DOI: 10.1007/s11814-016-0158-7

In development of modern electric fields, the growth of kinds of electronic devices has made the supply and research on heat dissipating films become important. To synthesize heat dissipation films with high thermal resistance for possible use in electronics applications, carbon black is doped into polyimide to increase the dissipating rate of films, at loadings of 50, 100, and 150 wt%. The resulting films display excellent thermal properties; the thermal conductivity of the film with 150 wt% carbon black is 5.59W∙m −1 K −1 , a value that is 35 times higher than that of pure polyimide (0.16W∙m −1 K −1 ). To theoretically confirm the increased dissipating ability of composite films, the Nielsen equation is used for verification. The experimental results show an excellent fit with the theoretical values calculated by the Nielsen equation. The great thermal stability of polyimide composite film with carbon black is verified by using TGA and DSC, the temperature for 1% thermal decomposition of the 150wt% film is 541°C, and the glass transition temperature is 315 °C. The heat conduction results also show high heat dissipation data, which make the carbon black composite polyimide films an excellent candidate for use in electric devices to deplete the heat generated.