Heat dissipation in high-power semiconductor lasers with heat pipe cooling system

This study focuses on the application of heat pipes in thermal management for high-power semiconductor lasers. The heat pipe cooling systems are used for heat dissipation in high-power semiconductor lasers. These systems are used instead of water cooling machines to realize a compact and lightweight...

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Bibliographic Details
Published in:Journal of mechanical science and technology 2017, 31(6), , pp.2607-2612
Main Authors: Shu, Shili, Hou, Guanyu, Wang, Lijie, Tian, Sicong, Vassiliev, Leonid L., Tong, Cunzhu
Format: Article
Language:English
Subjects:
Control
Cooling
Cooling systems
Copper
Dynamical Systems
Engineering
Heat pipes
Industrial and Production Engineering
Laser cooling
Lasers
Liquid cooling
Mechanical Engineering
Semiconductor lasers
Sintering (powder metallurgy)
Thermal management
Vibration
Wicks
기계공학
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Summary:This study focuses on the application of heat pipes in thermal management for high-power semiconductor lasers. The heat pipe cooling systems are used for heat dissipation in high-power semiconductor lasers. These systems are used instead of water cooling machines to realize a compact and lightweight laser module. The n-shaped heat pipe cooling system, which consists of eight 6 mm copper heat pipes with sintered powder wicks, can easily handle a heat load of up to 73 W from a single-laser unit. The fabricated U-shaped heat pipe cooling system, which consists of ten 12 mm copper heat pipes with sintered powder wicks, can easily handle a heat load of up to 300 W from five laser units. The optical power of the multi-laser module cooled by the U-shaped heat pipe cooling system reaches 210 W. These results indicate that high-power semiconductor lasers can be cooled using heat pipe cooling systems instead of water cooling machines.
ISSN:1738-494X
1976-3824
DOI:10.1007/s12206-017-0502-9