Enhancement of Thermal Conductivity of Poly(methylmethacrylate) Composites at Low Loading of Copper Nanowires

• Published in: Macromolecular research 2019, 27(11), , pp.1117-1123
• Main Authors: Thieu, Nhat Anh Thi, Vu, Minh Canh, Lee, Eui Sung, Doan, Vu Chi, Kim, Sung-Ryong
• Format: Article
• Language: English
• Subjects: Characterization and Evaluation of Materials; Chemistry; Chemistry and Materials Science; Complex Fluids and Microfluidics; Composite materials; Copper; Elongation; Heat conductivity; Heat transfer; High aspect ratio; Nanochemistry; Nanotechnology; Nanowires; Physical Chemistry; Polymer Sciences; Polymethyl methacrylate; Soft and Granular Matter; Thermal conductivity; Thermal diffusivity; Thermal resistance; Thermal stability; 고분자공학
• ISSN: 1598-5032; 2092-7673
• DOI: 10.1007/s13233-019-7155-8

We report the synthesis of copper nanowires (CuNWs) and the enhanced thermal conductivity of poly(methylmethacrylate) (PMMA) composites at low-loading fractions of CuNW. The scanning electron microscope, X-ray diffractometer, thermal diffusivity meter, high-resistance meter, universal testing machine, and thermogravimetric analyzer were used to investigate the properties of CuNW/PMMA composites. The elongation strain to failure, toughness, and thermal stability of the PMMA composites significantly increased with increasing contents of CuNW. The CuNW/PMMA composites showed the thermal conductivity and volume resistivity of 0.85 W/mK and 7×10 10 Ω·m, respectively, at 2.0 wt% of CuNW. The significant improvement of thermal conductivity is attributed to the well-dispersed CuNWs in the PMMA matrix and the high aspect ratio of CuNWs. The experimental results of thermal conductivity fitted well with the Agari model.