Novel Bumping Process for Solder on Pad Technology

A novel bumping process using solder bump maker is developed for the maskless low‐volume solder on pad (SoP) technology of fine‐pitch flip chip bonding. The process includes two main steps: one is the aggregation of powdered solder on the metal pads on a substrate via an increase in temperature, and...

Full description

Saved in:
Bibliographic Details
Published in:ETRI journal 2013, 35(2), , pp.340-343
Main Authors: Choi, Kwang‐Seong, Bae, Ho‐Eun, Bae, Hyun‐Cheol, Eom, Yong‐Sung
Format: Article
Language:English
Subjects:
low‐volume solder on pad (SoP) technology
Maskless bumping
powdered solder
resin
Sn3.0Ag0.5Cu
전자/정보통신공학
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:A novel bumping process using solder bump maker is developed for the maskless low‐volume solder on pad (SoP) technology of fine‐pitch flip chip bonding. The process includes two main steps: one is the aggregation of powdered solder on the metal pads on a substrate via an increase in temperature, and the other is the reflow of the deposited powder to form a low‐volume SoP. Since the surface tension that exists when the solder is below its melting point is the major driving force of the solder deposit, only a small quantity of powdered solder adjacent to the pads can join the aggregation process to obtain a uniform, low‐volume SoP array on the substrate, regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of 130 μm is successfully formed.
ISSN:1225-6463
2233-7326
DOI:10.4218/etrij.13.0212.0302