Novel Maskless Bumping for 3D Integration

A novel, maskless, low‐volume bumping material, called solder bump maker, which is composed of a resin and low‐melting‐point solder powder, has been developed. The resin features no distinct chemical reactions preventing the rheological coalescence of the solder, a deoxidation of the oxide layer on...

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Bibliographic Details
Published in:ETRI journal 2010, 32(2), , pp.342-344
Main Authors: Choi, Kwang‐Seong, Sung, Ki‐Jun, Lim, Byeong‐Ok, Bae, Hyun‐Cheol, Jung, Sunghae, Moon, Jong‐Tae, Eom, Yong‐Sung
Format: Article
Language:English
Subjects:
low‐melting‐point solder
Maskless bumping
solder bump maker (SBM)
전자/정보통신공학
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Summary:A novel, maskless, low‐volume bumping material, called solder bump maker, which is composed of a resin and low‐melting‐point solder powder, has been developed. The resin features no distinct chemical reactions preventing the rheological coalescence of the solder, a deoxidation of the oxide layer on the solder powder for wetting on the pad at the solder melting point, and no major weight loss caused by out‐gassing. With these characteristics, the solder was successfully wetted onto a metal pad and formed a uniform solder bump array with pitches of 120 µm and 150 µm.
ISSN:1225-6463
2233-7326
DOI:10.4218/etrij.10.0209.0396