Precision Molding of Polymeric Multi-Channel Optical Interconnection Devices Considering the Coefficient of Thermal Expansion of the Materials

Polymeric multi-channel optical interconnection devices that are usually fabricated by transfer molding are indispensable for parallel interconnection in high speed, high capacity optical communication systems. This paper proposes a design technique considering the thermal behavior of materials, suc...

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Bibliographic Details
Published in:ETRI journal 2003, 25(4), , pp.266-269
Main Authors: Ahn, Seung-Ho, Han, Sang-Pil, Choi, Choon-Gi, Jeong, Myung-Yung
Format: Article
Language:Korean
Subjects:
전자/정보통신공학
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Summary:Polymeric multi-channel optical interconnection devices that are usually fabricated by transfer molding are indispensable for parallel interconnection in high speed, high capacity optical communication systems. This paper proposes a design technique considering the thermal behavior of materials, such as shrinkage and expansion during the molding process, to satisfy geometrical requirements that have less than 1 ${\mu}m$ tolerance. We also designed molds considering the thermal effects of the materials and fabricated multi-channel optical fiber connectors that have less than 1 ${\mu}m$ tolerance.
ISSN:1225-6463
2233-7326