Thermal stability and strength of deformation microstructures in pure copper

The plastic flow field produced by machining is utilized to access a range of deformation parameters in pure copper: strains of 1–7, strain rates of 1–1000s−1 and temperatures as low as 77K. The strength and stability of the severe plastic deformation microstructures including cellular, elongated, e...

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Bibliographic Details
Published in:Acta materialia 2012-06, Vol.60 (10), p.4107-4116
Main Authors: Saldana, C., King, A.H., Chandrasekar, S.
Format: Article
Language:English
Subjects:
Alloys
Applied sciences
Copper
COPPER (PURE)
DEFORMATION
Deformation twinning
Elongation
Exact sciences and technology
GRAIN SIZE AND SHAPE
MACHINING
MATERIALS SCIENCE
Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology
Metals. Metallurgy
Microstructure
MICROSTRUCTURES
Nanocrystalline Cu
Severe plastic deformation
Stability
STRAIN RATE
Strength
THERMAL STABILITY
UFG
Ultrafine-grained (UFG) microstructure
ultrafine-grained microstructure
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Summary:The plastic flow field produced by machining is utilized to access a range of deformation parameters in pure copper: strains of 1–7, strain rates of 1–1000s−1 and temperatures as low as 77K. The strength and stability of the severe plastic deformation microstructures including cellular, elongated, equiaxed and twinned types are characterized. Unique combinations of strengthening and stability are identified in the case of heavily twinned microstructures. These observations offer insights for improving the stability of both single-phase and multicomponent ultrafine-grained alloys.
ISSN:1359-6454
1873-2453
DOI:10.1016/j.actamat.2012.04.022