Thermal Modeling of TIVA Profiles of a Polysilcon-Metal Test Structure

Thermal modeling and simulations were used to analyze the thermal profiles of a polysilicon-metal test structure generated by thermally-induced voltage alteration (TIVA), a new laser-based failure analysis technique to localize shorted interconnects. The results show that variations in TIVA thermal...

Full description

Saved in:
Bibliographic Details
Published in:Journal of applied physics 1999-09
Main Authors: Benson, D.A., Cole, E.I. Jr, Tangyunyong, Paiboon
Format: Article
Language:English
Subjects:
CONNECTORS
DETECTION
ELECTRICAL FAULTS
ENERGY ABSORPTION
ENGINEERING
LASER RADIATION
MATHEMATICAL MODELS
METALS
NONDESTRUCTIVE TESTING
SILICON
TEMPERATURE DISTRIBUTION
THERMAL CONDUCTIVITY
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Thermal modeling and simulations were used to analyze the thermal profiles of a polysilicon-metal test structure generated by thermally-induced voltage alteration (TIVA), a new laser-based failure analysis technique to localize shorted interconnects. The results show that variations in TIVA thermal profiles are due mainly to preferential laser absorption in various locations in the test structure. Differences in oxide thickness also affect the local heat conduction and temperature distribution. Modeling results also show that local variation in heat conduction is less important than the absorbed laser power in determining the local temperatures since our test structure has feature sizes that are small compared to the length over which heat spreads.
ISSN:0021-8979
1089-7550