Gas Suppression via Copper Interlayers in Magnetron Sputtered Al-Cu 2 O Multilayers

• Published in: ACS applied materials & interfaces 2017-07, Vol.9 (26), p.22026-22036
• Main Authors: Kinsey, Alex H, Slusarski, Kyle, Sosa, Steven, Weihs, Timothy P
• Format: Article
• Language: English
• Subjects: Materials Science; Science & Technology - Other Topics
• ISSN: 1944-8244; 1944-8252
• DOI: 10.1021/acsami.7b03071

The use of thin-foil, self-propagating thermite reactions to bond components successfully depends on the ability to suppress gas generation and avoid pore formation during the exothermic production of brazes. To study the mechanisms of vapor production in diluted thermites, thin film multilayer Al-Cu-Cu O-Cu foils are produced via magnetron sputtering, where the Cu layer thickness is systematically increased from 0 to 100 nm in 25 nm increments. The excess Cu layers act as diffusion barriers, limiting the transport of oxygen from the oxide to the Al fuel, as determined by slow heating differential scanning calorimetry experiments. Furthermore, by adding excess Cu to the system, the temperature of the self-propagating thermite reactions drops below the boiling point of Cu, eliminating the metal vapor production. It is determined that Cu vapor production can be eliminated by increasing the Cu interlayer thickness above 50 nm. However, the porous nature of the final products suggests that only metal vapor production is suppressed via dilution. Gas generation via oxygen release is still capable of producing a porous reaction product.