Transfer Printing Techniques for Materials Assembly and Micro/Nanodevice Fabrication

• Published in: Advanced materials (Weinheim) 2012-10, Vol.24 (39), p.5284-5318
• Main Authors: Carlson, Andrew, Bowen, Audrey M., Huang, Yonggang, Nuzzo, Ralph G., Rogers, John A.
• Format: Article
• Language: English
• Subjects: additive transfer; Assembly; Biomimetics; deterministic assembly; flexible electronics; Humans; MATERIALS SCIENCE; Microtechnology - instrumentation; Microtechnology - methods; Nanostructures - chemistry; Nanotechnology - instrumentation; Nanotechnology - methods; Printing - methods; Semiconductors; subtractive transfer; transfer print
• ISSN: 0935-9648; 1521-4095
• DOI: 10.1002/adma.201201386

Transfer printing represents a set of techniques for deterministic assembly of micro‐and nanomaterials into spatially organized, functional arrangements with two and three‐dimensional layouts. Such processes provide versatile routes not only to test structures and vehicles for scientific studies but also to high‐performance, heterogeneously integrated functional systems, including those in flexible electronics, three‐dimensional and/or curvilinear optoelectronics, and bio‐integrated sensing and therapeutic devices. This article summarizes recent advances in a variety of transfer printing techniques, ranging from the mechanics and materials aspects that govern their operation to engineering features of their use in systems with varying levels of complexity. A concluding section presents perspectives on opportunities for basic and applied research, and on emerging use of these methods in high throughput, industrial‐scale manufacturing. Transfer printing represents a set of techniques for deterministic assembly of micro‐ and nanomaterials into spatially organized, functional arrangements. The results provide not only test structures for scientific study, but also routes to high‐performance, heterogeneously integrated systems. This article summarizes recent advances in a variety of transfer printing techniques, from mechanics and materials aspects governing the operation, to engineering use in complex systems, to perspectives on high throughput, industrial‐scale manufacturing.