Printing of electromagnetic interference shielding materials

The proliferation of electronic devices has made electromagnetic interference (EMI) shielding an exponentially growing business. Regulatory requirements change constantly as new technologies continue to emerge. Innovations in materials and new advances in shielding implementation techniques are need...

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Bibliographic Details
Published in:Flexible and printed electronics 2023-06, Vol.8 (2), p.25003
Main Authors: Doshi, Pranay, Wong, Hiu Yung, Gutierrez, Daniel H, Lopez, Arlene, Nordlund, Dennis, Gandhiraman, Ram P
Format: Article
Language:English
Subjects:
atmospheric pressure plasma jet
electromagnetic interference shielding
MATERIALS SCIENCE
metal printing
plasma printing
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Summary:The proliferation of electronic devices has made electromagnetic interference (EMI) shielding an exponentially growing business. Regulatory requirements change constantly as new technologies continue to emerge. Innovations in materials and new advances in shielding implementation techniques are needed to pass regulatory compliance tests at an affordable cost. Here, we print various EMI shielding materials such as copper, silver and a composite of copper with Fe 3 O 4 using plasma jet printing. Printing enables shields only a few microns thick capable of high shielding effectiveness. Copper’s EMI shielding performance is primarily contributed by reflection mechanism, as expected and this is known to cause secondary pollution. A Green Index for EMI shielding, given by the ratio of absorption and reflection contributions to shielding, indicates values lower than 0.1 for printed copper films.
ISSN:2058-8585
2058-8585
DOI:10.1088/2058-8585/acc879