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Ultra-sensitive H2O2 sensing with 3-D porous Au/CuO/Pt hybrid framework
A 3-D porous Au/CuO/Pt hybrid platform is proposed to overcome the drawbacks of non-enzymatic H2O2 sensing. The Au/CuO/Pt hybrid sensor exhibits an extraordinary catalytic performance towards H2O2 reduction with an ultra-high sensitivity of 25,836 µA mM−1 cm−2 and a limit of detection of 1.8 nM (S/N...
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Published in: | Sensors and actuators. B, Chemical Chemical, 2023-12, Vol.396 (C), p.134512, Article 134512 |
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Main Authors: | , , , , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | A 3-D porous Au/CuO/Pt hybrid platform is proposed to overcome the drawbacks of non-enzymatic H2O2 sensing. The Au/CuO/Pt hybrid sensor exhibits an extraordinary catalytic performance towards H2O2 reduction with an ultra-high sensitivity of 25,836 µA mM−1 cm−2 and a limit of detection of 1.8 nM (S/N = 3). It demonstrates an excellent anti-interference ability for NaCl, fructose, ascorbic acid, citric acid, dopamine, and glucose. The hybrid Au/CuO/Pt sensor exhibits outstanding stability for a wide range of molarity applications as well as a stable current for a long period of 30 h. These rank the proposed Au/CuO/Pt framework as one of the best-performing non-enzymatic H2O2 sensors. The rapid redox reaction is the synergistic result of superior catalytic response, large electrochemical-active surface area, high conductivity, and improved electron transfer pathways offered by the unique configuration of high porosity and metallic nano-micro-NP decoration.
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•Demonstration of 3D porous Au/CuO/Pt hybrid architecture to overcome the limitations of non-enzymatic H2O2 sensing.•Demonstration of a record high sensitivity of 25,836 µA mM−1 cm−2 and LOD of 1.8 nM.•Demonstration of excellent selectivity against interfering molecules.•Demonstration of outstanding stability and a wide linear range of 0.5 µM – 10 mM.•Demonstration of on-chip biosensor kit on a single chip including the WE, RE and CE. |
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ISSN: | 0925-4005 1873-3077 |
DOI: | 10.1016/j.snb.2023.134512 |