Probabilistic Thermal-Shock Strength Testing Using Infrared Imaging

A thermal‐shock strength‐testing technique has been developed that uses a high‐resolution, high‐temperature infrared camera to capture a specimen's surface temperature distribution at fracture. Aluminum nitride (AlN) substrates are thermally shocked to fracture to demonstrate the technique. The...

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Bibliographic Details
Published in:Journal of the American Ceramic Society 1999-12, Vol.82 (12), p.3605-3608
Main Authors: Wereszczak, Andrew A., Scheidt, Rebecca A., Ferber, Mattison K., Breder, Kristin
Format: Article
Language:English
Subjects:
ALUMINIUM NITRIDES
Applied sciences
Building materials. Ceramics. Glasses
Ceramic industries
Chemical industry and chemicals
Exact sciences and technology
FINITE ELEMENT METHOD
General studies
INFRARED THERMOGRAPHY
MATERIALS SCIENCE
MATHEMATICAL MODELS
Technical ceramics
TEMPERATURE DEPENDENCE
THERMAL EXPANSION
THERMAL SHOCK
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Description
Summary:A thermal‐shock strength‐testing technique has been developed that uses a high‐resolution, high‐temperature infrared camera to capture a specimen's surface temperature distribution at fracture. Aluminum nitride (AlN) substrates are thermally shocked to fracture to demonstrate the technique. The surface temperature distribution for each test and AlN's thermal expansion are used as input in a finite‐element model to determine the thermal‐shock strength for each specimen. An uncensored thermal‐shock strength Weibull distribution is then determined. The test and analysis algorithm show promise as a means to characterize thermal shock strength of ceramic materials.
ISSN:0002-7820
1551-2916
DOI:10.1111/j.1151-2916.1999.tb02285.x