Loading…
Carrier compensation near tail region in aluminum- or boron-implanted 4H-SiC (0001)
Electrical behavior of implanted Al and B near implant-tail region in 4H-SiC (0001) after high-temperature annealing has been investigated. Depth profiles of Al and B acceptors determined by capacitance-voltage characteristics are compared with those of Al and B atoms measured by secondary-ion-mass...
Saved in:
Published in: | Journal of applied physics 2005-08, Vol.98 (4), p.043709-043709-7 |
---|---|
Main Authors: | , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Summary: | Electrical behavior of implanted Al and B near implant-tail region in 4H-SiC (0001) after high-temperature annealing has been investigated. Depth profiles of Al and B acceptors determined by capacitance-voltage characteristics are compared with those of Al and B atoms measured by secondary-ion-mass spectrometry. For
Al
+
(aluminum-ion) implantation, slight in-diffusion of Al implants occurred in the initial stage of annealing at
1700
°
C
. The profile of the Al-acceptor concentration in a "box-profile" region as well as an "implant-tail" region is in good agreement with that of the Al-atom concentration, indicating that nearly all of the implanted Al atoms, including the in-diffused Al atoms, work as Al acceptors. Several electrically deep centers were formed by
Al
+
implantation. For
B
+
(boron-ion) implantation, significant out- and in-diffusion of B implants occurred in the initial stage of annealing at
1700
°
C
. A high density of B-related
D
centers exists near the tail region. In the tail region, the sum of B-acceptor concentration and
D
-center concentration corresponds to the B-atom concentration.
C
+
(carbon-ion) coimplantation with a ten times higher dose than
B
+
effectively suppressed the B diffusion, but additional deep centers were introduced by
C
+
coimplantation. |
---|---|
ISSN: | 0021-8979 1089-7550 |
DOI: | 10.1063/1.2030411 |